The present disclosure relates to a system for sensing temperature changes on a microsecond scale. The system uses a multi-channel pyrometer that works in the NIR spectrum to receive thermal radiation. Each channel includes an interference filter tuned to pass thermal radiation within a specified wavelength range, and a detector. Each detector detects thermal radiation focused on it. Each channel further includes an interference filter which reflects thermal radiation which does not pass through it to a subsequent downstream interference filter of a subsequent channel. Each subsequent interference filter is oriented to reflect the thermal radiation not passing through it to a next downstream one of the subsequent interference filters. A subsystem is included for receiving the output from the detectors and determining sensed temperature data therefrom, allowing measurement of temperatures down to 800 K.

The present disclosure relates to a system for sensing temperature changes on a microsecond scale. The system uses a multi-channel pyrometer that works in the NIR spectrum to receive thermal radiation. Each channel includes an interference filter tuned to pass thermal radiation within a specified wavelength range, and a detector. Each detector detects thermal radiation focused on it. Each channel further includes an interference filter which reflects thermal radiation which does not pass through it to a subsequent downstream interference filter of a subsequent channel. Each subsequent interference filter is oriented to reflect the thermal radiation not passing through it to a next downstream one of the subsequent interference filters. A subsystem is included for receiving the output from the detectors and determining sensed temperature data therefrom, allowing measurement of temperatures down to 800 K.

A multispectral or thermal imager comprising a lens assembly, an array of IC chips that is arranged in a field of view of the lens assembly, each IC chip comprising an array of thermopile devices, and a filter assembly comprising one or more wavelength filters. The filter assembly comprises a respective wavelength filter for at least one of the three or more rows of IC chips. At least one wavelength filter is transparent in a portion of a wavelength range that passes through the lens assembly. The filter assembly is configured such that radiation of the same wavelength range passes to the rows of IC chips in the pair of non-adjacent rows, and such that the wavelength range that passes to the rows in the pair of non-adjacent rows is different from a wavelength range that passes to the one or more rows other than the pair of non-adjacent rows.

In one embodiment, an infrared (IR) imaging system for determining a concentration of a target species in an object is disclosed. The imaging system can include an optical system including an optical focal plane array (FPA) unit. The optical system can have components defining at least two optical channels thereof, said at least two optical channels being spatially and spectrally different from one another. Each of the at least two optical channels can be positioned to transfer IR radiation incident on the optical system towards the optical FPA. The system can include a processing unit containing a processor that can be configured to acquire multispectral optical data representing said target species from the IR radiation received at the optical FPA. Said optical system and said processing unit can be contained together in a data acquisition and processing module configured to be worn or carried by a person.

A multispectral or thermal imager comprising a lens assembly, an array of IC chips that is arranged in a field of view of the lens assembly, and a filter assembly comprising one or more wavelength filters. The filter assembly comprises a respective wavelength filter for at least one of the three or more rows of IC chips. At least one wavelength filter is transparent in a portion of a wavelength range that passes through the lens assembly. The filter assembly is configured such that radiation of the same wavelength range passes to the rows of IC chips in the pair of non-adjacent rows, and such that the wavelength range that passes to the rows in the pair of non-adjacent rows is different from a wavelength range that passes to the one or more rows other than the pair of non-adjacent rows.

Apparatus and methods of processing substrates include a detector manifold to detect radiation from proximate a processing area in a chamber body; a radiation detector optically coupled to the detector manifold; and a spectral multi-notch filter. Apparatus and methods of processing substrates include detecting transmitted radiation from an emitting surface of a substrate in a chamber body; conveying at least one spectral band of the detected radiation to a photodetector; and analyzing the detected radiation in the at least one spectral band to determine an inferred temperature of the substrate.

In one embodiment, an infrared (IR) imaging system for determining a concentration of a target species in an object is disclosed. The imaging system can include an optical system including an optical focal plane array (FPA) unit. The optical system can have components defining at least two optical channels thereof, said at least two optical channels being spatially and spectrally different from one another. Each of the at least two optical channels can be positioned to transfer IR radiation incident on the optical system towards the optical FPA. The system can include a processing unit containing a processor that can be configured to acquire multispectral optical data representing said target species from the IR radiation received at the optical FPA. Said optical system and said processing unit can be contained together in a data acquisition and processing module configured to be worn or carried by a person.

A fiber optic sensor, a process for utilizing a fiber optic sensor, and a process for fabricating a fiber optic sensor are described, where a double-side-polished silicon pillar is attached to an optical fiber tip and forms a Fabry-Prot cavity. In an implementation, a fiber optic sensor in accordance with an exemplary embodiment includes an optical fiber configured to be coupled to a light source and a spectrometer; and a single silicon layer or multiple silicon layers disposed on an end face of the optical fiber, where each of the silicon layer(s) defines a Fabry-Prot interferometer, and where the sensor head reflects light from the light source to the spectrometer. In some implementations, the fiber optic sensor may include the light source coupled to the optical fiber; a spectrometer coupled to the optical fiber; and a controller coupled to the high speed spectrometer.

A flame detector includes a beam splitter to split mid-wave infrared radiation (MWIR) and long-wave infrared radiation (LWIR) into an MWIR component and an LWIR component. An MWIR detector detects the MWIR component and an LWIR detector detects the LWIR component. The flame detector analyzes the MWIR component to determine the presence of a flame and analyzes the LAIR component to determine whether the system is functioning properly.

A sensor includes an InGaAs photodetector configured to convert received infrared radiation into electrical signals. A notch filter is operatively connected to the InGaAs photodetector to block detection of wavelengths within at least one predetermined band. An imaging camera system includes an InGaAs photodetector configured to convert received infrared radiation into electrical signals, the InGaAs photodetector including an array of photodetector pixels each configured to convert infrared radiation into electrical signals for imaging. At least one optical element is optically coupled to the InGaAs photodetector to focus an image on the array. A notch filter is operatively connected to the InGaAs photodetector to block detection of wavelengths within at least one predetermined band. A ROIC is operatively connected to the array to condition electrical signals from the array for imaging.