In one embodiment, a tissue planing assembly includes a base frame, a plurality of disassemblable components assembled to the base frame and having a ready configuration, a sample conveyor, a blade assembly configured to be coupled to the base frame, a control unit communicatively coupled to the sample conveyor, and one or more component sensors communicatively coupled to the control unit. The plurality of disassemblable components is configured to support a tissue sample. The sample conveyor is configured to convey the tissue sample through the blade assembly. The one or more components sensors are configured to output a signal indicative of at least one of the plurality of disassemblable components missing from the ready configuration, wherein the control unit prohibits operation of the sample conveyor when at least one of the plurality of disassemblable components is missing from the ready configuration.

Systems and methods are provided for enhanced thin-film specimen preparation solutions. A cutting device may be used in preparing thin-film specimens. The cutting device may have one or more cutting elements configured to apply uniform cuts into a thin-film specimen sheet as the cutting device is moved over the thin-film specimen sheet. A cutting base may be used to maintain the thin-film specimen sheet in place as the cutting device is moved to apply the cuts. The cutting base may be configured for placement on top of the thin-film specimen sheet. The cutting base and the cutting device are integrated together, or may be separate components. The one or more cutting elements may be rotating blades. The one or more cutting elements may be evenly spaced

Provided is a microtomic system and process for the preparation of sections for microscope examination. A cutting edge in the system can cut through a sample block and produce a section one end of which remains attached to the cutting edge. A voltage generator can generate a voltage and apply the voltage between the cutting edge and a section receiver such as a semiconductor chip grid. Through electrostatic force caused by the voltage, another end of the section can anchor to the section receiver. The section is then spread on the receiver. The system is automatable, highly efficient, and does not need liquid to float sample sections, and can therefore maintain the integration of the sample sections.

Provided is a process of using a microtomic system for the preparation of sections for microscope examination. A cutting edge in the system can cut through a sample block and produce a section one end of which remains attached to the cutting edge. A voltage generator can generate a voltage and apply the voltage between the cutting edge and a section receiver such as a semiconductor chip grid. Through electrostatic force caused by the voltage, another end of the section can anchor to the section receiver. The section is then spread on the receiver. The system is automatable, highly efficient, and does not need liquid to float sample sections, and can therefore maintain the integration of the sample sections.

A seed slicer device (100), which has: a first plate (102) provided with first holes (104); a second plate (106) provided with second holes (108), adapted to fit over the first plate; a sliding plate (110) slidably coupled to a top portion of the second plate, operable to cover the second holes; a third plate (112) provided with a third holes (114), adapted to fit over the second plate; and a cutting assembly (116) coupled to the third plate and adapted to slide over the third holes to provide a slicing action; the seeds are received by the third holes such that at least a first part of the seeds extend beyond the third holes, and, upon actuation of the cutting assembly, the seeds are cut by the cutting means to divide the seeds into corresponding first parts and second parts.

A method of sampling a multi-layered material and a micro-sampling tool are described. The sampling method includes penetrating a top surface of a material in a component of interest with a micro-cutting tool to a predetermined depth sufficient to include each layer of the multi-layered material and a portion of the base, without cutting through the full depth of the base, under-cutting from the depth of penetration through the base to define a micro-sample of the multi-layered material, and removing the micro-sample with each layer of the multi-layered material intact. The micro-sampler includes a cutting tool calibrated to cut to a depth no greater than 2 mm, and in some aspects, no greater than 200 microns into a multi-layered material, the material having a top surface and a metallic or ceramic base and a container for removing and storing a micro-sample cut from the material with each layer of the multi-layered material and a portion of the base intact.