Systems and methods for surface inspection for imaging an object via an optical coherence tomography (OCT) imaging modality are provided. The system includes an OCT imaging module for generating imaging data from a surface under inspection, including: an electromagnetic radiation source for interrogating the object with light; an optical system having an interferometer for generating an interference pattern corresponding to the light backscattered from the object; and a detector for detecting the interference pattern and generating imaging data therefrom; a motion controller device for moving at least one component of the OCT imaging module relative to the object, the motion controller device moving the OCT imaging module such that a surface of the object is within a depth of field of the OCT imaging module; and a computational module for: aggregating the imaging data; and determining the presence or absence of surface defects in the imaging data.

A surface defect inspecting device for hot-dip coated steel sheets comprising: an illuminating unit for illuminating an imaging target portion on a hot-dip coated steel sheet; a specular reflection light imaging unit for imaging specular reflection light from the imaging target portion; a diffuse reflection light imaging unit for imaging diffuse reflection light from the imaging target portion; and an image signal processing unit for processing specular reflection image and diffuse reflection image signals, the specular and diffuse reflection light imaging units simultaneously imaging light reflected from the imaging target region, the image signal processing unit extracting a portion having brightness level lower than a predetermined threshold, as a defect portion, from the specular reflection image signal, and threshold processing the diffuse reflection image signal, with respect to a portion corresponding to an extracted defect portion, to determine a defect type by classifying the extracted defect portion.

A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.

A defect inspection apparatus includes a first objective lens having an optical axis is perpendicular to a wafer mounting surface of the stage, a second objective lens having an optical axis forms a predetermined acute angle with respect to the wafer mounting surface of the stage, and a dichroic mirror which reflects light having a first wavelength and transmits or reflects light having a second wavelength. Emitted light of a first optical path 111 from a first light source which is reflected from or transmitted through the dichroic mirror and first emitted light and second emitted light polarized and separated from a second light source which are transmitted through or reflected from the dichroic mirror are incident on the first objective lens, and emitted light of a second optical path from the first light source is incident on the second objective lens.

A method for fabricating a semiconductor structure includes providing a substrate and a first layer over the substrate, wherein the first layer includes one or more overlay marks. The method further includes forming one or more layers on the first layer and performing a dark field (DF) inspection on the one or more overlay marks underlying the one or more layers to receive a post-film-formation data.

The invention describes a machine for printing material webs (4), which comprises a station (1, 11, 41) for monitoring the printed material web (4), with the station (1, 11, 41) for monitoring the material web (4) comprising a sensor (3, 13) for monitoring the web (4) and at least one counter support (2, 12) for guiding the web (4), with at least one counter support (2, 12) being located on the side of the web (4) facing away from the sensor (3, 13). The invention is characterized by a device for providing blow air, which shows jets (6, 7) extruding blow air in the area of the station (1, 11, 41) for monitoring the material web (4) at the side of the material web (4) facing the sensor (3, 13).

An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.

A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.

An inspection system with selectable apodization includes a selectably configurable apodization device disposed along an optical pathway of an optical system. The apodization device includes one or more apodization elements operatively coupled to one or more actuation stages. The one or more actuation stages are configured to selectably actuate the one or more apodization elements along one or more directions. The inspection system includes a control system communicatively coupled to the one or more actuation stages. The control system is configured to selectably control an actuation state of at the one or more apodization elements so as to apply a selected apodization profile formed with the one or more apodization elements.

A multiple mode evaluation system that includes a multiple mode imager that is arranged to perform a single scan of a substrate while alternating between different optical modes thereby producing different sets of images of areas of the substrate, each set of images being associated with a single optical mode of image acquisition; wherein the different optical modes differ from each other by at least one optical characteristic.