A method and system for automated in-line inspection of optically transparent material is disclosed herein. The method includes illuminating a top and bottom surface of the optically transparent material with at least one sheet of light and then generating an image based on light that is received by an imaging device. The image that is generated may either be a bright field image or a dark field image.

Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.

A manual inspection system and method to inspect for defects in Contact lenses comprising; an image acquisition system with at least two high resolution cameras; Top illumination light head used for acquiring Bright field images; a Backlit illumination module to acquire Dark field images; at least another back lit illumination module to acquire a different type of Bright field images; an interchangeable mechanism to change measurement gauges suitable for a particular product; a rotating wheel embedded with multiple optical filters to cater to different imaging requirements; a first camera to capture the full view of the contact lens at a beam splitter; a second camera suitably mounted on a swivel arm to capture a higher resolution image of a selected defective area as viewed on a projection screen; a glass template or measurement gauge mounted at a suitable position to achieve overlaid images of the lens and the gauge on a projection screen for taking measurements; a flexible template measurement gauge as an optional overlay, to replace the glass template, suitably mounted on the projection screen for easy measurement of defects and geometry of the contact lens; an XYZ table to position the contact lens; creating a database on the computer that tabulates geometrical information and detailed defect information along with their respective positional information; and subsequently analyzing the database images to arrive at corrective actions to the manufacturing process to improve the quality and yields in the contact lens.

A method for locating, in a deposition line including a succession of compartments, an origin of a defect affecting a stack of thin layers deposited on a substrate in the compartments, in which each thin layer is deposited in one or more successive compartments of the deposition line and pieces of debris remaining on the surface of a thin layer deposited in a compartment act as masks for the subsequent depositions of thin layers and are the origin of defects, includes obtaining at least one image showing the defect, determining, from the at least one image, a signature of the defect, the signature containing at least one characteristic representative of the defect, and identifying at least one compartment of the deposition line liable to be the origin of the defect from the signature of the defect and using reference signatures associated with the compartments of the deposition line.

The invention relates to a method for checking a printing cylinder for defects in an engraved cylinder surface of the printing cylinder, comprising the steps: capturing a first and at least one further digital image of a cylinder surface of a printing cylinder by means of an optical capture unit, wherein the cylinder surface is cleaned before capturing the at least one further image, comparing the digital images each with a digital engraving master of the printing cylinder, the comparing comprising: determining deviations between each of the digital images and the digital engraving master, and checking the determined deviations for matching deviations between the digital images,
wherein a pseudo defects is concluded if no matching deviations between the digital images have been detected when comparing, and wherein an engraving defect on the printing cylinder is concluded in the case of matching deviations. Furthermore, a corresponding arrangement is described.

One variation of an optical inspection kit includes: an enclosure defining an imaging volume; an optical sensor adjacent the imaging volume and defining a field of view directed toward the imaging volume; a nest module defining a receptacle configured to locate a surface of interest on a first unit of a first part within the imaging volume at an image plane of the optical sensor; a dark-field lighting module adjacent and perpendicular to the nest module and including a dark-field light source configured to output light across a light plane and a directional light filter configured to pass light output by the dark-field light source normal to the light plane and to reject light output by the dark-field light source substantially nonparallel to the light plane; and a bright-field light source proximal the optical sensor and configured to output light toward the surface of interest.

An illumination module may include a laser diode array configured to emit laser radiation; a phosphor illumination unit that is configured to emit phosphor radiation following an exposure to the laser radiation; a multiple-angle illumination unit; and intermediate optics that is configured to convey the phosphor radiation to the multiple-angle illumination unit. The multiple-angle illumination unit is configured to receive the phosphor radiation and to dark field illuminate a region of a sample wafer from multiple angles during inspection of the wafer.

The present invention provides an information processing apparatus for determining, for a substrate having undergone an imprint process that forms a pattern of an imprint material, presence/absence of a formation defect of the pattern, including a generating unit configured to generate learning models in one-to-one correspondence with a plurality of different illumination conditions by using images obtained by capturing images of a plurality of substrates on which the pattern is formed under the plurality of illumination conditions, and an obtaining unit configured to input the images obtained by capturing images of the substrates having undergone the imprint process and containing the pattern, to a plurality of learning models generated by the generating unit, and obtain a temporary determination result temporarily indicating the presence/absence of a formation defect of the pattern from each of the plurality of learning models.

Systems and methods for illuminating and/or inspecting one or more features of a unit under test (UUT) are disclosed herein. A system configured in accordance with embodiments of the present technology can include, for example, a machine, one or more diffuser elements, and/or one or more light sources. The system can create and adjust brightfield illumination profiles (e.g., uniform, brightfield illumination profiles) on portions (e.g., on curved features) of the UUT by, for example, using the one or more light sources and/or the one or more diffuser elements to adjust diffuse and/or specular illumination projected onto the curved features of the UUT. In some embodiments, the system includes one or more darkfield light sources configured to project illumination onto second portions of the UUT to create a darkfield illumination profile. The system can capture data of the brightfield and/or darkfield illumination profiles and can thereby inspect portions of the UUT.

A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.