An inspection system is provided for detecting defects on surfaces. The system uses a pattern with varying color or darkness which faces the surface. A light illuminates the pattern on the surface so that the pattern and any defects on the surface are reflected and captured for image analysis. The processor then separates the pattern from the image in order to identify the locations of any defects on the surface.

An inspection system is provided for detecting defects on surfaces. The system uses a pattern with varying color or darkness which faces the surface. A light illuminates the pattern on the surface so that the pattern and any defects on the surface are reflected and captured for image analysis. The processor then separates the pattern from the image in order to identify the locations of any defects on the surface.

A wafer surface defect inspection method and a wafer surface defect inspection apparatus are provided. The method includes the following steps. Scanning information of a wafer is received, and the scanning information includes multiple scanning parameters. At least one reference point of the scanning information is determined, and path information is generated according to the at least one reference point and a reference value. Multiple first scanning parameters corresponding to the path information in the scanning parameters are obtained according to the path information to generate a curve chart. According to the curve chart, it is determined whether the wafer has a defect, and a defect type of the defect is determined.

The present invention provides a marking apparatus for a display panel and a marking method for a display panel. The marking device comprises an image acquiring module, a simulated marking module and a real marking module. A simulated marking line is drawn, by the simulated marking module, in an image acquired by the image acquiring module, of a region containing a position where a defect occurs on a display panel to be marked. The real marking module automatically draws a real marking line on the display panel to be marked according to the simulated marking line. Thus, a position where a defect occurs on a display panel to be marked is accurately marked, and it is convenient for an engineer to accurately locate and sample the defective position in the subsequent analysis process.

A method and device for automatically identifying a point of interest in a depth measurement on a viewed object using a video inspection device is disclosed. The video inspect device determines the three-dimensional coordinates in a region of interest on the viewed object and analyzes those surface points to determine the desired measurement application (e.g., determining the deepest point, the highest point, or the clearance between two surfaces). Based on the desired measurement application, the video inspection device automatically identifies the point of interest on the viewed object and places a cursor at that location.

Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

A laser repair method includes a repair process of performing repair work by setting a laser radiation range for a defect part in a multi-layer film substrate and irradiating the defect part with a laser beam under set laser working conditions. In the repair process, spectrum data of the defect part is acquired, and the laser working conditions of the laser beam, with which the defect part is to be irradiated, are set using a neural network after learning on the basis of the spectrum data, and the neural network has undergone machine learning using, as learning data, measurement data including multi-layer film structure data, spectrum data of each multi-layer film structure, and laser working experimental data of each multi-layer film structure.

The present invention relates to defects inspection on a silicon carbide wafer or an epitaxial layer thereon to determine the location, and adjustment of the location of the scribe line, which is a separation line forming a gap between adjacent dies. The present invention can obtain high efficiency and economy in the semiconductor process using wafers containing various defects in the surface and thin film, by minimizing the effect of wafer defects on the final yield of the semiconductor chip or die, via adjustment of scribe line positions arranged on the wafer.

Disclosed herein is a high throughput optical scanning system to generate super resolution images and methods of use. The optical scanning device and methods of use provided herein can allow high throughput scanning of a continuously moving object with a high resolution despite fluctuations in stage velocity. This can aid in high throughput scanning of a substrate, such as a biological chip comprising fluorophores. Also provided herein are improved optical relay systems and scanning optics.

A system for analyzing thermal properties of a railroad includes a thermal imaging device configured to generate thermal image data reproducible as a thermal image of a portion of the railroad, the thermal image data being associated with a location of the portion of the railroad, an electronic display device, a memory device configured to receive and store therein the generated thermal image data; and one or more processors configured to: determine a temperature metric of the portion of the railroad based at least in part on the thermal image data; and cause the electronic display device to display (i) a first graph indicative of the temperature metric of the portion of the railroad and (ii) a second graph indicative of a railroad track geometry metric associated with the location of the portion of the railroad.