There is provided a technique that includes: a camera configured to capture images of the target object; a memory configured to store the images of the target object and feature data including one or more predetermined exterior features of the target object; and a processor configured to: determine a first process configuration for an operation including a plurality of image processes; perform the operation under the first process configuration; generate inspection data from the sets of images that have been processed; generate an inspection score by comparing the inspection data with the feature data; compare the inspection score with a predetermined threshold score; set the first process configuration as an optimal configuration if the inspection score satisfies the predetermined threshold score.

The embodiments disclose a method for in-situ inspection and processing of an object including providing a pulsed laser source during the in-situ inspection of a surface of the object for modifying at least one of an optical, mechanical, or chemical property of a first region of the surface, directing the laser source through an optics path to shape, position and focus a pulsed laser beam at the first region, directing a probe illumination light beam to the optics path to produce a combined and collinear optical light path of the probe illumination light beam and the pulsed laser beam to focus and deliver the combined and collinear optical light path at a same region on the surface, superimposing a first focus spot of the probe illumination light beam over a second focus spot of the pulsed laser beam on an illuminated region of the surface.

A semiconductor wafer fault analysis system includes: a database to store a first reference map, which is classified as a first fault type, and a second reference map, which is classified as a second fault type; a first auto-encoder/decoder to remove a noise corresponding to the first fault type from the first reference map to generate a first pre-processed reference map; a second auto-encoder/decoder to remove a noise corresponding to the second fault type from the second reference map to generate a second pre-processed reference map; and a fault type analyzer. The database is updated based on the first and second pre-processed reference maps, and the fault type analyzer is to classify a fault type of a target map based on the updated database. The target map is generated by measuring a target wafer.

A belt examination system includes a defect candidate detecting processor that detects a candidate for a belt defect that is an abnormal portion of an intermediate transfer belt of an image forming apparatus from a belt image that is an image of the intermediate transfer belt, the defect candidate detecting processor executes a background pattern reduction step to reduce a texture-pattern like background noise present in the belt image and detects the candidate based on the belt image generated during the background pattern reduction step, and the background pattern reduction step is to replace, in the belt image, a color value within a specific range of color values not including a lowest color value of the belt defect with a specific color value within the specific range.

A method is disclosed. The method may include generating a first optical image of a sample with a first inspection sub-system. The first optical image may be generated when a first set of photoluminescent markers are emitting photoluminescent illumination at a first time interval. The method may include generating additional optical images with an additional inspection sub-system. The additional optical images may be generated when additional photoluminescent markers are emitting photoluminescent illumination at additional time intervals. The method may include generating an accumulated optical image based on the first optical image and the additional optical images. The method may include determining a location of the photoluminescent markers based on the accumulated optical image. The method may include determining a pattern of the sample based on the determined location of the photoluminescent markers.

A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

A surface-defect detecting method of optically detecting a surface defect of a steel material, the method including: an irradiation step of irradiating an examination target part with illumination light beams from different directions by using two or more distinguishable light sources; and a detection step of detecting a surface defect in the examination target part based on the degree of overlapping of bright portions extracted from two or more images formed by reflected light beams of the illumination light beams.

A test device for testing a needle mark generated in an electrode formed in a test object when a probe needle contacts the electrode includes an imaging part having a binning function, and a controller configured to control at least the imaging part. The controller is configured to perform a high-speed low-precision test process of imaging the electrode, after a contact operation by the probe needle, by the imaging part whose binning function is on, and determining a state of the needle mark of the electrode, based on an imaging result, and a low-speed high-precision test process of imaging the electrode again by the imaging part whose binning function is off, according to a determination result in the high-speed low-precision test process, and determining a state of the needle mark of the electrode imaged again, based on an imaging result.

The disclosure provides an appearance inspection system that can reduce subject blurring when an object is imaged while changing a relative position of an imaging device with respect to the object. A first control unit causes the imaging device to perform imaging when the imaging device reaches an imaging position corresponding to the inspection target position. A second control unit changes at least one of the position and the orientation of the imaging device in a direction in which a relative movement between a field of view of the imaging device and the inspection target position according to the change in the relative position along a designated path is canceled out during a predetermined period including a time point at which the imaging device reaches the imaging position.

There is provided a technique that includes: a camera configured to capture images of the target object; a memory configured to store the images of the target object and feature data including one or more predetermined exterior features of the target object; and a processor configured to: determine a first process configuration for an operation including a plurality of image processes; perform the operation under the first process configuration; generate inspection data from the sets of images that have been processed; generate an inspection score by comparing the inspection data with the feature data; compare the inspection score with a predetermined threshold score; set the first process configuration as an optimal configuration if the inspection score satisfies the predetermined threshold score.