Patent classifications
G01N21/95623
EUV VESSEL INSPECTION METHOD AND RELATED SYSTEM
A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices
The present disclosure regards a large area functional metrology system for inspecting nanophotonic devices. The large area functional metrology system can include one or more light sources, optical components such as lenses and polarizers, and one or more camera sensors. The light source can irradiate light onto a nanophotonic device while the optical components can guide the light through the system and modulate states of the light. The camera sensor can record images of the nanophotonic device interacting with the irradiated light. The images can be taken as a function of one or more states. The system can also include a detector which can processes the images in order to detect defects. The defects can then be classified using one or more defect signatures. Based on this classification, the root causes of the defects can be automatically identified.
Arbitrary wavefront compensator for deep ultraviolet (DUV) optical imaging system
Disclosed is a system that includes a light source for generating an illumination beam and an illumination lens system for directing the illumination beam towards a sample. The system further includes a collection lens system for directing towards a detector output light from the sample in response to the illumination beam and a detector for receiving the output light from the sample. The collection lens system includes a fixed-design compensator plate having individually selectable filters with different configurations for correcting system aberration of the system under different operating conditions. The system also includes a controller operable for: (i) generating and directing the illumination beam towards the sample, (ii) selecting operating conditions and a filter for correcting the system aberration under such selected operating conditions, (iii) generating an image based on the output light, and (iv) determining whether the sample passes inspection or characterizing such sample based on the image.
MULTI-PERSPECTIVE WAFER ANALYSIS
Disclosed herein is a method for detecting defects on a sample. The method includes obtaining scan data of a region of a sample in a multiplicity of perspectives, and performing an integrated analysis of the obtained scan data. The integrated analysis includes computing, based on the obtained scan data, and/or estimating cross-perspective covariances, and determining presence of defects in the region, taking into account the cross-perspective covariances.
EUV vessel inspection method and related system
A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
Non-Invasive Measurement of the Pitch of a Braid
Described embodiments include a system for inspecting a tubular device that includes an outer surface and a spatially-periodic supporting structure beneath the outer surface. The system includes an imaging device, configured to acquire an image of a reflection of light from the outer surface, and a processor, configured to ascertain a spatial frequency of the supporting structure by processing the image. Other embodiments are also described.
Material Testing By Angle-Variable Illumination
An optical system includes an illumination module configured to illuminate a sample object with at least one angle-variable illumination geometry. The optical system includes an imaging optical unit configured to produce an imaged representation of the sample object that is illuminated with the at least one angle-variable illumination geometry on a detector. The optical system includes the detector, which is configured to capture at least one image of the sample object based on the imaged representation. The optical system includes a controller configured to determine a result image based on a transfer function and the at least one image. A method includes illuminating a sample object with at least one angle-variable illumination geometry, imaging the sample object on a detector, based on the imaged representation, capturing at least one image of the sample object, and, based on a transfer function and the at least one image, determining a result image.
Defect detection device and defect observation device
Provided is a defect detection device including an illumination unit including a condenser lens and a plurality of light beam synthesis units, and a detection unit detecting scattered light generated on a sample by the illumination unit. The condenser lens condenses a plurality of light beams, emitted onto the sample and having substantially the same wavelength and substantially the same polarization, on the sample. The plurality of light beam synthesis units bring the plurality of light beams close to each other and make the light beams have light paths parallel to the optical axis of the condenser lens.
Phase contrast monitoring for extreme ultra-violet (EUV) masks defect inspection
Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle using an optical inspection tool. An inspection tool having a pupil filter positioned at an imaging pupil is used to obtain a test image or signal from an output beam that is reflected and scattered from a test portion of an EUV test reticle. The pupil filter is configured to provide phase contrast in the output beam. A reference image or signal is obtained for a reference reticle portion that is designed to be identical to the test reticle portion. The test and reference images or signals are compared and it is determined whether the test reticle portion has any candidate defects based on such comparison. For each of a plurality of test reticle portions of the reticle, the operations for using the inspection tool, obtaining a reference image or signal, comparing, and determining are repeated. A defect report is generated based on any candidate defects that have been determined to be present.
Apparatus for Detecting Sample Properties Using Chaotic Wave Sensor
Provided is a sample property detecting apparatus including: a wave source configured to irradiate a wave towards a sample; a detector configured to detect a laser speckle that is generated when the wave is multiple-scattered by the sample, at every time point that is set in advance; and a controller configured to obtain a temporal correlation that is a variation in the detected laser speckle according to time, and to detect properties of the sample in real-time based on the temporal correlation, wherein the detector detects the laser speckle between the sample and the detector or from a region in the detector.