In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.

A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

An inspection system including an illumination subsystem and an image sensing subsystem, the illumination subsystem providing a plurality of illumination modalities, the system simultaneously illuminating at least two areas of an object with different ones of the plurality of illumination modalities, images of which are acquired by a single sensor forming part of the image sensing subsystem.

A method comprises obtaining a plurality of 2-dimensional gray scale images of a portion of a printed circuit board assembly. Each 2-dimensional gray scale image corresponds to one of a plurality of parallel planes intersecting the portion of the printed circuit board assembly at respective different locations. The method further comprises converting the plurality of 2-dimensional gray scale images into a color image. Each of the plurality of 2-dimensional gray scale images corresponds to and is used as input for a respective color channel of the color image. The method further comprises analyzing the color image to detect variation in color that indicates a defect; and outputting an alert indicating the defect in response to detecting the variation in color.

A defect detection system comprising of an incoherent light source and a collimating light source attachment to produce spatially coherent light waves (e.g., X-rays) that are capable of deeply penetrating a device under test (e.g., a semiconductor). Changes in the spatial coherency of the light waves incident upon the device under test may be utilized to generate one or more electronic maps that indicate one or more defects within the device under test, such as, cracks, gaps, and/or air pockets within the device under test.

A method is provided that includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.

A method of automatically setting optical parameters, using Automatic Optical Inspection (AOI) System, the method includes the following steps. Firstly, a recommended object image is obtained when the AOI system is set under a first recommended optical parameter set. Then, a computation is performed on an object standard picture and a recommended object image to obtain a recommended error value between the object standard picture and the recommended object image according to an optimized error function. Then, whether the recommended error value converges is determined. Then, when the recommended error value does not converge, a computation is performed to obtain a second recommended optical parameter set according to the recommended error value and the first recommended optical parameter set. Then when the recommended error value converges, the first recommended optical parameter set is decided as an optimal optical parameter set of the AOI system.

A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.

An inspection apparatus may include: a structured-light source configured to sequentially radiate a plurality of structured lights having one phase range; a lens configured to adjust, for each of the plurality of structured lights, optical paths of light beams corresponding to phases of the phase range such that a light beam corresponding to one phase of the phase range arrives at each point of a partial region on an object; an image sensor configured to capture a plurality of reflected lights generated by the structured lights being reflected from the partial region; and a processor configured to acquire a light quantity value of the reflected lights; and derive an angle of the surface by deriving phase values of the reflected lights based on the light quantity value for the reflected lights.

An inspection device that performs inspection by using an inspection image of a board on which multiple components are disposed, the inspection device includes a fixed focus type camera, a lifting/lowering mechanism configured to move the camera up or down relative to the board, a setting section configured to acquire height information of the components, and set a reference position separated from a top surface of the board by a distance corresponding to a height of each of the components according to a predetermined setting method such that an imaging surface of each component within an imaging range of the camera is included in a depth of field of the camera, and a control section configured to control the lifting/lowering mechanism and the camera such that the inspection image is captured after the camera is relatively moved up or down to focus on the reference position.