A method is provided that includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.

An image acquisition device including a first plurality of cameras arranged in a mutually spaced configuration, each having a field of view, each field of view lying in a plane and a second plurality of photon emitters arranged in a multiplicity of generally circumferential arrangements about each camera of the first plurality of cameras, at least one photon emitter within the generally circumferential arrangement directing light to a field of view of one of the first plurality of cameras that is not the closest field of view thereto.

An inspection device includes: an analyzer to calculate a parameter representing a feature of image data of an object having no defect by performing dimensionality reduction on the image data, and perform dimensionality reduction on image data of an object to be inspected by using the parameter; a restorer to generate restored data obtained by restoring the image data of the object to be inspected subjected to the dimensionality reduction; a corrector to filter the restored data by using a filter for correcting an error between the restored data and the image data of the object to be inspected, thereby generating corrected restored data; a determiner to output a determination result indicating whether the object to be inspected is defective, based on a difference of each pixel between the image data of the object to be inspected and the corrected restored data; and an interface to output the determination result.

An image inspecting apparatus includes at least one image capturing part, a lighting part, a control part including a moving part, a searching part analyzing an image captured by the image capturing part under a first image capturing condition and searching for a defect candidate from an object under inspection, and a determining part. When the searching part finds the defect candidate from the object under inspection, the control part controls an image capturing condition such that a part where the defect candidate is found by the searching part is photographed under a second image capturing condition that is clearer than the first image capturing condition. The determining part analyzes an image captured by the image capturing part under the second image capturing condition and determines whether the defect of the object under inspection is present or absent.

A method implemented by a software for a multimodal evaluation engine stored on a memory is provided herein. The software is executable by a processor coupled to the memory to cause the method. The method includes receiving multimodal signatures of an object of interest from inspection elements and processing the multimodal signatures to transform the multimodal signatures into formats. The method also includes generating data representations of the formats and detecting whether anomalies are present within the object of interest based on the data representations.

The present disclosure proposes an inspection apparatus. The inspection apparatus may include: a structured-light source configured to sequentially radiate a plurality of structured lights having one phase range; a lens configured to adjust, for each of the plurality of structured lights, optical paths of light beams corresponding to phases of the phase range such that a light beam corresponding to one phase of the phase range arrives at each point of a partial region on an object; an image sensor configured to capture a plurality of reflected lights generated by the structured lights being reflected from the partial region; and a processor configured to acquire a light quantity value of the reflected lights; and derive an angle of the surface by deriving phase values of the reflected lights based on the light quantity value for the reflected lights.

The board inspecting apparatus include a measuring section obtaining measurement data for at least a portion of a board, a processing section comparing the measurement data and pre-obtained reference data, based on feature objects set on the board, to perform warpage compensation and inspecting the board with warpage compensated, a display section displaying ranges adjusting a first level of an inspection speed and a second level of a precision of the warpage compensation, and an input section receiving, from a user, inputs for the first and second levels as a specific setting combination having a trade-off relationship. The processing section, when the inspection speed and the precision are established, designates a specific option corresponding to the inspection speed and the precision among options increasing the precision so that the specific option is applied. Thus, users' convenience may be improved, and users may easily set options for distortion compensation.

The invention concerns a method of optical, inspection of an electronic circuit (Card) including the acquisition of images of the electronic circuit by image sensors (C), the use of the images to determine the offset between the position of the electronic circuit (Card) and an inspection position, and the use of said images in at least another step of the method.

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.