An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.

In a first defect candidate area detected on the basis of a difference between a value of each pixel in a picked-up image and a value of a corresponding pixel in a reference image and a second defect candidate area detected on the basis of a ratio between a value of each pixel in the picked-up image and a value of a corresponding pixel in the reference image, an overlapping area is detected as a defect area. It is thereby possible to suppress detection of a false defect and detect a defect with high accuracy. In a preferable defect detection part, a shaking comparison part detects a defect candidate area on the basis of a difference in the pixel value between the picked-up image and the reference image, and a false information reducing part limits pixels to be used for obtaining the above ratio to those included in the defect candidate area.

An illuminating unit for illuminating an imaging range of a monochromatic camera mounted on a board work machine for working on a board includes a red light source configured to emit a red light, a green light source configured to emit a green light, a blue light source configured to emit a blue light, and a lighting controller configured to adjust independently respective light amounts of the red light source, the green light source, and the blue light source in the same number of gradations within a predetermined dimming range. In the red light source, the green light source, and the blue light source, the upper limit of the dimming range of the light source having the strong light amount is smaller than the upper limit of the dimming range of the light source having the weak light amount.

Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.

A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection. Sidewall illuminators and sidewall beam splitters can form portions of a five sided inspection apparatus that includes a brightfield illuminator, a darkfield illuminator, and an image capture beam splitter such that the five sided inspection apparatus is configurable for inspecting component bottom surfaces and/or component sidewalls in a selective/selectable manner.

Systems and methods are provided for enhancing object feature visibility for overhead imaging. In one embodiment, a computing system can obtain information associated with one or more locations of an imaging platform and one or more locations of a solar source. The system can determine one or more positional ranges of the imaging platform relative to the solar source based, at least in part, on such information. The positional ranges can be indicative of positions at which the imaging platform is to obtain image frames depicting at least a portion of a target object. The system can send, to the imaging platform, a set of data indicative of the positional ranges and can receive, from the imaging platform, a set of data indicative of the image frames depicting at least a portion of the target object. The image frames being captured based, at least in part, on the positional ranges.

An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.

A computer-implemented method and device are directed to a geometric analysis of a result of a manufacturing process or of a simulation of a manufacturing process in which a part (14) is formed from a planar sheet of material by means of a tool (1). The result comprises result model, being a computer based representation of the part after the (real or simulated) manufacturing process. The method comprises the computer-implemented steps of retrieving the result model (2); retrieving a reference model (3), the reference model being a mesh based model derived from a CAD model representing a target shape of the part or a tool shape; determining an improved result model (33) by transforming the mesh of the reference model (3) to match the shape of the result model (2); performing a geometric analysis on the basis of the improved result model (33).

An electronic component inspection apparatus includes: a holding unit that holds an electronic component having a component body and terminals; light sources and reflection plates that irradiate reflected light at least on the terminals of the electronic component held by the holding unit, from the side of a back face opposite to a mounting face of the electronic component; a camera that captures an image of the electronic component under irradiation of the reflected light, from the side of the mounting face; and a control unit that controls processing related to inspection of the electronic component, on the basis of the image of the electronic component captured by the camera.

According to an embodiment of a specimen inspection apparatus, the specimen inspection apparatus may comprise: a radiation unit; a reflection unit; a focus adjusting unit; a reception unit; and a control unit. The specimen inspection apparatus may comprise: a radiation unit for emitting a terahertz wave; a reflection unit for changing the path of a terahertz wave emitted from the radiation unit; a focus adjusting unit for forming an irradiation region on a specimen according to the path of the terahertz wave; a reception unit for receiving individual terahertz waves obtained by reflection, by the specimen, of the terahertz wave irradiated onto the first region; and a control unit for controlling the distance between at least two elements among the plurality of elements, and detecting whether the specimen is defective, according to the reflectivity difference between the terahertz waves.