A system, apparatus and method for detecting a porous object are provided. The system includes a light emitting module, a detecting module and an analyzing module. The light emitting module emits light onto an object to be measured such that the light passes through a plurality of holes of the object. The detecting module has a porous plate having a plurality of non-circular holes and a plurality of photosensitive units respectively corresponding to the non-circular holes. Each of the non-circular holes corresponds to at most one of the holes at one time point. The light passes through the plurality of non-circular holes corresponding to the plurality of holes. The photosensitive units respectively sense luminous flux of the light passing through the plurality of non-circular holes to produce a luminous flux signal. The analyzing module analyzes a status of the plurality of holes corresponding to the plurality of non-circular holes.

Inspecting features of an object including measuring features of the master part that represents a desired nominal dimensions to obtain a preliminary set of dimensional data. The preliminary set of data becomes a master data set. The same master part is measured on a second machine to obtain another set of data on the master part. The two data sets are compared and correction data is generated representing differences between the different data sets for the same master part measured on different machines. Subsequent parts are then measured on the second machine to obtain measurement data that is corrected based on the correction data. The application of the correction information provides for the use of 5-axis machines within a desired measurement capability.

A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.

A method of inspecting a component comprising a cellular structure bonded to a carrier substrate to form a matrix of open-ended cells is described. The method comprises: submerging the component in an inspection liquid disposed within a pressure vessel; changing the pressure within the pressure vessel; withdrawing the component from the inspection liquid; and determining whether the cells of the component are filled with the inspection liquid. A corresponding inspection apparatus is also described.

Method and apparatus testing engine component, for blockage of one or more through-holes in a portion of a wall. The method including (i) providing a supply of test fluid, (ii) causing or permitting flow of test fluid to occur from first to second region, (iii) illuminating the second region with electromagnetic radiation to cause scattering of electromagnetic radiation by material exiting substantially non-blocked through-holes in wall portion having passed therethrough from the first to second side, (iv) detecting said scattering of electromagnetic radiation from said substantially non-blocked through-holes; and (v) comparing said detected scattering of electromagnetic radiation from said substantially non-blocked holes with known pattern of through-holes in component wall portion to determine the presence and/or location and/or identity of any blocked or partially blocked through-holes in component wall portion.

Example embodiments relate to an apparatus and method for inspecting a substrate defect. The substrate defect inspecting apparatus includes a substrate, a light source emitting an infrared beam to the substrate, a detector detecting the infrared beam reflected from the substrate, and a defect analyzer receiving first information and second information from the detector and analyzing defects existing in the substrate. According to at least one example embodiment, the second information is acquired during a later process than the first information.

An inspection system and method are presented for inspecting structures having a pattern formed by an array of elongated grooves having high aspect-ratio geometry, such as semiconductor wafers formed with vias. The inspection system comprises an imaging system and a control unit. The imaging system is configured and operable for imaging the structure with a dark-field imaging scheme and generating a dark-field image. The control unit comprises an analyzer module for analyzing pixels brightness in the dark-field image for identifying a defective groove, being a groove characterized by pixels brightness in the dark-field image lower than nominal brightness by a predetermined factor.

In a conductive film, a method of evaluating a pattern in the conductive film, and a display device, thin metal lines of at least one wiring portion of two wiring portions is formed in a wiring pattern where the opening portions, of which angles are maintained and pitches are made to be irregular with respect to rhomboid shapes of a regular rhomboid wiring pattern, have parallelogram shapes. In frequencies of the moirs that are equal to or less than a frequency threshold value and are calculated for each color from two peak frequencies and two peak intensities of 2DFFT spectra of image data of the wiring patterns of the two wiring portions and luminance image data of pixel array patterns of the respective colors at the time of lighting up for each single color, the wiring patterns of the two wiring portions are formed such that an indicator of evaluation of moirs is equal to or less than an evaluation threshold value. The indicator of evaluation is calculated from evaluation values of the moirs of the respective colors obtained by applying human visual response characteristics in accordance with an observation distance to intensities of the moirs equal to or greater than an intensity threshold value.

An in situ inspection system and method to inspect a honeycomb body (122) skin in a skinning system. The inspection system includes a line illuminator (148) to generate a line illumination on the skin (136) perpendicular to an axial direction (112) of the honeycomb body travel, and a detector (152) to detect the line illumination scattered from the skin (136) and generate a signal based on the detected line illumination. A controller (184) is configured to receive the signal generated by the detector (152), compare the received signal to a previously stored defect free signal in real-time, and control at least one skinning process parameter based on the comparison. The method includes in situ inspecting the skin (136) and controlling at least one skinning process parameter based on the inspection. In the method, the in situ inspection includes illuminating a line of the skin (136) perpendicular to the axial direction (112) and detecting the illuminated line scattered from the skin (136).

A method of inspecting a component comprising a cellular structure bonded to a carrier substrate to form a matrix of open-ended cells is described. The method comprises: submerging the component in an inspection liquid disposed within a pressure vessel; changing the pressure within the pressure vessel; withdrawing the component from the inspection liquid; and determining whether the cells of the component are filled with the inspection liquid. A corresponding inspection apparatus is also described.