A measuring apparatus to measure adhesive performance of a Pressure Sensitive tape or label, which includes an electric or pneumatic actuator that can be triggered manually or remotely to perform a rolling ball tack evaluation at different or extreme conditions to those standardized in an adhesives laboratory, by using a small laboratory oven or small weathering chamber to simulate those extreme conditions. Also, installing this apparatus inside of those chambers and triggering it remotely through the mentioned actuator installed in the apparatus. The triggering systems includes; a power source to convert the standard laboratory high voltage source to low DC voltage to avoid the risk of an electric shock during the apparatus operation, a couple of metallic isolated cables for electric conduction of voltage to the actuator electric coil, an electric control box containing a momentary push button switch, the actuator containing an electric coil, a spring and a metallic mobile piston, and a mechanical fastening system to attach the actuator to the apparatus and the piston to the mechanical ball release system.

A glass strength evaluation apparatus includes a support unit, a plate disposed on the support unit and including a surface on which a glass article, which is a target to be tested, is disposed, a fixing jig disposed on the plate and a power unit lifting up or down the fixing jig in a vertical direction toward the surface of the plate. The fixing jig includes a body portion, which extends in the vertical direction and lower fixing bolts. A press-fitting member insertion opening is recessed from a bottom of the body portion to extend in an upward direction, lower fixing bolt insertion holes penetrate the body portion, from one side of the body portion, in a first horizontal direction intersecting the vertical direction, to be extended to the press-fitting insertion opening, and lower fixing bolts are coupled into the lower fixing bolt insertion holes.

A film structure puncture testing tool for testing the resistance to puncturing of a film structure for a product package and a method for analyzing film structures resistance to puncturing.

Methods, devices, and systems for testing the flexibility of a sample such as an electronic device are provided herein. A testing system can have a motor operably connected to a mandrel such that the motor causes the mandrel to accurately and precisely rotate and cause the sample to conform to an outer surface of the mandrel. Moreover, a proximal end of the sample is secured to the outer surface of the mandrel, and the opposing distal end is controlled by a retractable holder such that the entire sample is subjected to a constant bend radius as the mandrel rotates. Other aspects and features such as controlling the environment around the mandrel and securing small samples to the mandrel are also described herein.

A heating system for use in mechanical testing at scales of microns or less includes a stage heater. The stage heater having a stage plane, and a stage heating element distributed across the stage plane. Two or more support mounts are on opposed sides of the stage plane. A first bridge extends from the stage plane to a first mount of the two or more support mounts, and a second bridge extends from the stage plane to a second mount of the two or more support mounts. The first and second bridges provide a plurality of supports between the stage plane and two or more support mounts to accordingly support the stage plane. In another example, the heating system includes a probe heater configured to heat a probe as part of mechanical testing.

The present disclosure provides for a guide for use in a compression test, the compression test comprising loading a test sample between a first loading plate and an opposing load applied between the test sample and the first loading plate in a loading direction, the guide comprising: at least one support member, positionable between the first loading plate and the load and extending substantially parallel to the loading direction to constrain the test sample in a direction perpendicular to the loading direction, wherein, when in use, the at least one support member is positioned to define a space between the first loading plate and the support member such that when a load is applied the test sample is deformable in a direction perpendicular to the loading direction within the space.

An apparatus for testing a sheet of brittle material is disclosed. The apparatus can include a plurality of assemblies configured for selectively applying a 3-point bending load on an edge of the sheet of material in a test region of the apparatus, a detection mechanism that optically measures strain in the sheet of material in the region, and a processor that determines the stress in the sheet based on the measured strain by calculating the stress that would be required to produce the measured strain in the sheet of material.

The present invention provides a method for evaluating a semiconductor wafer concerning a breaking strength of a notch portion of the semiconductor wafer, comprising: applying a load to a notch portion of the semiconductor wafer to be evaluated toward the center of the wafer such that the notch portion of the semiconductor wafer is broken; and evaluating the breaking strength of the notch portion. The present invention provides a method and an apparatus for evaluating a semiconductor wafer that can evaluate the breaking strength of a notch portion of a semiconductor wafer with higher precision and higher sensitivity.

A universal materials testing machine is disclosed. In one embodiment, the machine comprises a plurality of grips holding a circular material specimen sheet; the grips being capable of pulling the material specimen radially outward. Each grip is connected to a force measurement sensor such as a load cell. The grip and the load cell assembly is connected to a linear actuator assembly. The linear actuator assembly comprises a motor connected to an arm that can move along a straight line. The actuator pulls or pushes the load cell and grip assembly. A camera module captures images of the specimen while being stretched or released. A data processing system gathers camera module images along with force measurements from the load cells. An analysis module running on the data processing unit computes stress and strain measurements and fits them to user selectable material model.

The invention relates to a device for carrying out bending tests on panel-shaped or beam-shaped samples (1), in which two rotary drives are arranged at a distance from one another and a flange (3) is fastened to each of the drive shafts of the rotary drives, said drive shafts being oriented parallel to one another. At least two bar-shaped bending elements (2) oriented parallel to the axis of rotation of the drive shafts and arranged at a distance from the axis of rotation and at a distance from one another are provided on each of the flanges (3). A panel-shaped or beam-shaped sample (1) can be introduced between the two bar-shaped bending elements (2) on the two flanges (3). In the event of rotation of the rotary drives in opposite directions of rotation, bending forces are exerted on the sample (1) and each of the two rotary drives can be controlled individually and connected to an electronic open-loop or closed-loop control unit.