One embodiment includes a method for dynamic self-calibration of an accelerometer system. The method includes forcing a proof-mass associated with a sensor of the accelerometer system in a first direction to a first predetermined position and obtaining a first measurement associated with the sensor in the first predetermined position via at least one force/detection element of the sensor. The method also includes forcing the proof-mass to a second predetermined position and obtaining a second measurement associated with the sensor in the second predetermined position via the at least one force/detection element of the sensor. The method further includes calibrating the accelerometer system based on the first and second measurements.

A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

In an acceleration sensor detecting a vibration acceleration by using torsion of a beam joining a fixed portion and a membrane, a spring constant of the beam is decreased while an increase in a chip size due to extension of the beam is prevented, so that an acceleration sensor that is highly sensitive and small in a size is provided with a low price. A sensor of a capacitance detecting type includes a membrane having a stacking structure formed of two or more layers and a plurality of beams capable of twisting so that the membrane is movable in a detecting direction, a first beam of the plurality of beams is formed of the same layer as either an upper or a lower layer of the membrane, and a second beam thereof is formed of the same layer as either an upper or a lower layer of the movable portion.

A multi-axis acceleration sensor comprises a frame, a central mass disposed within the frame, and a plurality of transducers mechanically coupled between the frame and the central mass. At least a first set of the transducers are arranged between the frame and the central mass in a manner configured to measure translational and rotational motion with respect to a first predefined axis.

A seismic sensor system includes a seismic sensor suspended in an acoustic medium, which is disposed between first and second sensor housings. The acoustic medium can be selected to preferentially transmit pressure wave energy, based on the acoustic impedance of the surrounding water column or other seismic medium. The acoustic medium can also be selected to preferentially dissipate or otherwise reduce the transmitted shear wave energy. The second housing can similarly be configured to dissipate shear wave energy, while transmitting pressure wave energy in the form of acoustic waves that propagate through the acoustic medium to the seismic sensor.

A microelectromechanical system (MEMS) accelerometer is described. The MEMS accelerometer is arranged to limit distortions in the detection signal caused by displacement of the anchor(s) connecting the MEMS accelerometer to the underlying substrate. The MEMS accelerometer may include masses arranged to move in opposite directions in response to an acceleration of the MEMS accelerometer, and to move in the same direction in response to displacement of the anchor(s). The masses may, for example, be hingedly coupled to a beam in a teeter-totter configuration. Motion of the masses in response to acceleration and anchor displacement may be detected using capacitive sensors.

A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.