A probe includes a pedestal and at least one feature extending from the pedestal to engage a surface of a corresponding contact at a position offset from a central longitudinal axis of the contact. The pedestal includes a cavity and the feature can include one or more blades that extend from a periphery of the cavity to a central longitudinal axis of the pedestal. The three blades are configured to engage the surface of the contact. The three blades can be positioned within the cavity to provide a 120-degree rotational symmetry about the central longitudinal axis of the pedestal.

A probe 20 electrically connecting a first contact target to a second contact target includes a tubular barrel portion 50, a first plunger portion 60 partially inserted into a first end of the barrel portion 50 and electrically contacting the first contact target, and a second plunger portion 70 partially inserted into a second end of the barrel portion 50 and electrically contacting the second contact target. The barrel portion 50 includes a first barrel portion 51 having an inside diameter ϕ1i, and a second barrel portion 52 arranged inside the first barrel portion 51 and having an outside diameter ϕ2o. The first barrel portion 51 includes a first spring portion 151. The second barrel portion 52 includes a second spring portion 152. The first plunger portion 60 includes a main body portion 61 having a longer dimension than an inside diameter of the first barrel portion 51.

A probe has a substantially bar shape, and includes a tip end, a base end, and a body portion that is located between the tip end and the base end and has a thickness in a thickness direction orthogonal to an axial direction of the substantially bar shape thinner than the tip end. The body portion includes a slope surface that is continuous with the tip end and is inclined with respect to the axial direction in a direction in which the thickness becomes gradually thinner with increasing distance from the tip end. A first region having a surface shape that bulges outward is provided in at least a part of the slope surface.

A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.

Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.

A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

The invention relates to a method for placing and contacting a contact element formed in particular as a test contact of a test contact arrangement, wherein in said method, for forming a heat transfer surface, a contact head provided with a contact element holding device, with the contact element received in the contact element holding device, is placed between the contact element and a contact material deposit arranged on a contact surface of a contact carrier in the direction of a feeding axis against a contact surface of the connecting material deposit, and, for realizing an at least partial fusing of the connecting material deposit and for producing a materially bonded connection between the contact element and the connecting material deposit, thermal energy is introduced into the connecting material deposit by means of treating the contact element with thermal energy, the temperature T of the contact element being measured while the contact element is being treated and the duration of the treatment being defined as a function of a determined temperature gradient dT/dt of the temperature T of the contact element.

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

A system for semiconductor wafer testing, a tangent probe card and a probe head assembly thereof. The system has a tangent probe card and a tester. Testing ends of the probe card are flat, hence the allowable alignment budget will always be more generous for the tangent probe card. The probes are held on the probe head assembly, and once the alignment is achieved accurately during manufacture, the alignment will remain stable throughout the whole life cycle. The probe has a greater CCC due to its larger cross section. The throughput of the tangent probes is higher than that of the conventional probe card since there is no need to move the pointed pin/structure. No pointed pin/structure needs to be repaired, and the flat bottom surface of the probe head assembly is easier to clean and maintain.

The present invention focuses on a material constituting a contact pin and a processing technique of the material, and is directed to manufacturing a conductive member by using a material and a processing technique which are different from those in the related art.

The conductive member is obtained by applying etching treatment to a copper-silver alloy including copper and silver while using at least copper alloy etching liquid, but silver etching liquid may also be selectively added to the copper alloy etching liquid.