A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

A contact probe may include a Ni pipe that may include a coiled spring structure, and the Ni pipe 11 may contain 0.5 to 10 wt % of phosphorus (P). The contact probe may have improved durability, by reducing shrinkage, after probing performed in a high temperature environment.

A probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member are disclosed. The probe member for the pogo pin has a contact portion including a material having hardness greater than the hardness of a first body portion and a second body portion, and each of the first and second body portions includes a material having electrical conductivity equal to or greater than 50% IACS (International Annealed Copper Standard).

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

The disclosure includes a contact device for electrical test, the contact device for electrical test including a second body portion, a first body portion stacked above the second body portion, a middle portion stacked above the first body portion, and having a first protrusion that is sharp and has a first apex portion, the first protrusion being formed on an upper side of the middle portion, and the first body portion, the middle portion, and the contact portion are sequentially and upwardly stacked, the middle portion and the contact portion include materials different from each other, and a first protrusion is provided inside the second protrusion.

Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match specific patterns on a CMOS chip or sample. The device provides for detailed studies of transport mechanisms in thin film materials and semiconductor devices.

An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).

Platinum-nickel-based ternary or higher alloys include platinum at about 65-80 wt. %, nickel at about 18-27 wt. %, and about 2-8 wt. % of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/or Ta. These alloys are age-hardenable, provide hardness greater than 580 Knoop, ultimate tensile strength in excess of 320 ksi, and elongation to failure of at least 1.5%. The alloys may be used in static and moveable electrical contact and probe applications. The alloys may also be used in medical devices.

An electrical connecting device includes an insulating probe (10) including a bottom-side plunger (11), a top-side plunger (12), and a barrel (13), and a probe head (30) including a combined guide plate (30A) having a conductive region (301) made of a conductive material and an insulating region (302) made of an insulating material arranged adjacent to each other in a planar view. The bottom-side plunger (11) and the top-side plunger (12) are electrically connected to each other inside the barrel (13), and the bottom-side plunger (11) and the top-side plunger (12) are electrically insulated from the barrel (13). The probe head (30) holds the insulating probe (10) in a state in which the barrel (13) penetrates through the conductive region (301). The barrel (13) of the insulating probe (10) is connected to a ground potential via the conductive region (301) when an inspection object (4) is measured.

The invention relates to a palladium-copper-silver alloy with palladium as the main component, wherein the palladium-copper-silver alloy has a weight ratio of palladium to copper of at least 1.05 and at most 1.6 and has a weight ratio of palladium to silver of at least 3 and at most 6, and wherein the palladium-copper-silver alloy contains more than 1 wt % and up to a maximum of 6 wt % of ruthenium, rhodium or ruthenium and rhodium and contains, as the remainder, palladium, copper and silver and at most 1 wt % of other metallic elements including impurities. The invention also relates to a wire, a strip or a probe needle made of such a palladium-copper-silver alloy and to the use of such a palladium-copper-silver alloy for testing electrical contacts or for making electrical contact or for producing a sliding contact.