A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

A hybrid automated testing equipment (ATE) system can simultaneously test electrical and optical components of a device under test, such as an optical transceiver. The device under test can be a multilane optical transceiver that transmits different channels of data on different lanes. The hybrid ATE system can include one or more light sources and optical switches in an optical test lane selector to selectively test and calibrate each optical and electrical components of each lane of the device under test.

The invention relates to a system in particular a quantum sensor system, for testing a device-under-test, DUT, comprising: an optically excitable medium which is arranged to receive electromagnetic, EM, radiation emitted by the DUT, at least one light source configured to irradiate the medium with at least one light beam, wherein the medium is optically excited by the at least one light beam, a field generator unit configured to generate an electric and/or magnetic field within the medium, wherein a resonance frequency of the excited medium is modified by an amplitude of the electric and/or magnetic field, wherein an optical parameter, in particular a luminescence, of the exited medium is locally modified if a frequency of the EM radiation corresponds to the resonance frequency at a position in the medium, an image detector configured to acquire an image of the medium, wherein the image shows an intensity profile that results from the modification of the optical parameter, a processor configured to analyze the DUT based on the acquired image.

A sensor head of a test and measurement instrument can include an input configured to receive an input signal from a device under test (DUT), an optical voltage sensor having signal input electrodes and control electrodes or one set of electrodes, wherein the input is connected to the signal input electrodes, and a bias control unit connected to the control electrodes and configured to reduce an error signal or the input signal bias control signal are electrically combined and applied to a single set of electrodes.

Described are various configurations for performing efficient optical and electrical testing of an opto-electrical device using a compact opto-electrical probe. The compact opto-electrical probe can include electrical contacts arranged for a given electrical contact layout of the opto-electrical device, and optical interface with a window in a probe core that transmits light from the opto-electrical device. An adjustable optical coupler of the probe can be mechanically positioned to receive light from the device's emitter to perform simultaneous optical and electrical analysis of the device.

An optical-electrical device can implement a feedback-based control loop for temperature of the device during component calibration. The optical-electrical device can implement compressed air to vary the device temperature during calibration. Additionally, non-active components of the device can be provided current to vary the temperature of the device in concert with the provided compressed air. Additional calibration temperatures can be implemented by activating and deactivating additional non-active components in the device, such as light sources, optical amplifiers, and modulators.

A hybrid optical-electrical automated testing equipment (ATE) system can implement an optical test assembly that includes an electrical interface and an optical interface with an optical-electrical device under test. The optical assembly can include a socket on which the device is placed by the ATE system to connect electrical and optical connections. The optical connections can couple light through the socket and the optical assembly to one or more testing devices to perform efficient testing of optical devices, such as high-speed optical transceivers.

A hybrid automated testing equipment (ATE) system can simultaneously test electrical and optical components of a device under test, such as an optical transceiver. The device under test can be a multilane optical transceiver that transmits different channels of data on different lanes. The hybrid ATE system can include one or more light sources and optical switches in an optical test lane selector to selectively test and calibrate each optical and electrical components of each lane of the device under test.

A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

In the field of the counting of objects, a use is provided of a photosensitive assembly comprising at least one photodiode or one photoresistor, and a source of uniform illumination for illuminating the assembly, the establishment of a reference current supplied by the photosensitive assembly for an illuminated region of this assembly corresponding to a given fraction of the surface of the assembly, the disposition of objects to be counted against the photosensitive assembly, the illumination of the assembly by the source, the objects masking a part of the surface of the assembly, measurement of the current supplied by the assembly, and determination of a ratio between measured current and reference current to deduce the proportion between the surface area of photosensitive element illuminated and the surface area masked by the objects disposed. From this ratio, information on the number of objects disposed on the photosensitive assembly is extracted.