.[.A unified system of programming communication. The system encompasses the prior art (television, radio, broadcast hardcopy, computer communications, etc.) and new user specific mass media. Within the unified system, parallel processing computer systems, each having an input (e.g., 77) controlling a plurality of computers (e.g., 205), generate and output user information at receiver stations. Under broadcast control, local computers (73, 205), combine user information selectively into prior art communications to exhibit personalized mass media programming at video monitors (202), speakers (263), printers (221), etc. At intermediate transmission stations (e.g., cable television stations), signals in network broadcasts and from local inputs (74, 77, 97, 98) cause control processors (71) and computers (73) to selectively automate connection and operation of receivers (53), recorder/players (76), computers (73), generators (82), strippers (81), etc. At receiver stations, signals in received transmissions and from local inputs (225, 218, 22) cause control processors (200) and computers (205) to automate connection and operation of converters (201), tuners (215), decryptors (224), recorder/players (217), computers (205), furnaces (206), etc. Processors (71, 200) meter and monitor availability and usage of programming..]. .Iadd.A method is described for controlling a receiver station using stored data specific to a user. By receiving a computer program transmitted from a transmitter station, the computer program is stored at the receiver station. Upon execution of the computer program, the data specific to a user is processed to generate information content at an output device..Iaddend.

A semiconductor device for testing a semiconductor wafer includes a circuit board, a probe disposed below the circuit board and facing the semiconductor wafer, an integrated substrate disposed between the circuit board and the probe, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The probe is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the probe through the integrated substrate and the circuit board to perform a test to the semiconductor wafer. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.

Described are various configurations for performing efficient optical and electrical testing of an opto-electrical device using a compact opto-electrical probe. The compact opto-electrical probe can include electrical contacts arranged for a given electrical contact layout of the opto-electrical device, and optical interface with a window in a probe core that transmits light from the opto-electrical device. An adjustable optical coupler of the probe can be mechanically positioned to receive light from the device's emitter to perform simultaneous optical and electrical analysis of the device.

A test probe assembly for determining the integrity of a test pad of a semiconductor wafer. The test probe assembly includes a probe card, a plurality of test probes mounted to the probe card, a fiber optic lead mounted to each test probe and arranged to direct incident light toward individual test pads of the semiconductor wafer and a plurality of photodetectors arranged about the probe card. Individual photodetectors are configured to receive light reflected off a dielectric coating of the test pad corresponding to a first set of light rays emitted by the test pad and configured to receive light reflected off a metallic base of the test pad corresponding to a second set of light rays emitted by the test pad, and to generate first and second output signals associated with the first and second sets of light rays to create image data of the individual test pads.

In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.

An apparatus for providing a test signal from a device under test (DUT) to a measurement instrument is disclosed. The apparatus includes a probe head configured to receive an electrical signal from the DUT. The probe head includes an electro-optic modulator. The apparatus also includes a control box, which includes an optical source. The optical source is configured to provide an input optical signal to the electro-optic modulator, which is configured to provide an output optical signal based on the electrical signal from the DUT. The control box also includes an optical bias control circuit. Only a bias control signal is provided to the electro-optic modulator.

.[.A unified system of programming communication. The system encompasses the prior art (television, radio, broadcast hardcopy, computer communications, etc.) and new user specific mass media. Within the unified system, parallel processing computer systems, each having an input (e.g., 77) controlling a plurality of computers (e.g., 205), generate and output user information at receiver stations. Under broadcast control, local computers (73, 205), combine user information selectively into prior art communications to exhibit personalized mass media programming at video monitors (202), speakers (263), printers (221), etc. At intermediate transmission stations (e.g., cable television stations), signals in network broadcasts and from local inputs (74, 77, 97, 98) cause control processors (71) and computers (73) to selectively automate connection and operation of receivers (53), recorder/players (76), computers (73), generators (82), strippers (81), etc. At receiver stations, signals in received transmissions and from local inputs (225, 218, 22) cause control processors (200) and computers (205) to automate connection and operation of converters (201), tuners (215), decryptors (224), recorder/players (217), computers (205), furnaces (206), etc. Processors (71, 200) meter and monitor availability and usage of programming..]. .Iadd.A method is described for providing a subscriber specific solution or recommend a subscriber specific action in at least one of a visual and an audible form at a receiver station. A remote data source stores digital data and receives a transmission originated from the receiver station. The subscriber specific solution or subscriber specific action is based on a subscriber specific analysis, and is dependent on transmitting the digital data from the remote data source to the receiver station. .Iaddend.

An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.

Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.

Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.