Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.

A method for testing LEDs includes: Step 1: providing a wafer including a plurality of LEDs and selecting N LEDs from the plurality of LEDs to form an LED group; Step 2: selecting n LEDs from the LED group, where 1<n<N, and testing the n LEDs at a time to obtain a subgroup optical parameter of the LED group; Step 3: performing the Step 2 on the N LEDs repeatedly and alternately for another n LEDs in the LED group to obtain a plurality of the subgroup optical parameters; and Step 4: obtaining an optical parameter of each of the LEDs in the LED group from the plurality of the subgroup optical parameters.

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.

A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.

A manufacturing process for electrode of neuromodulation probe includes the steps of: preparing a plurality of the manufacturing fixtures for electrode of neuromodulation probe; preparing a plurality of the manufacturing fixtures for electrode in a surrounding manner by having the first-layer frames to be externally disposed side by side with the bevels of the two neighboring first-layer frames close to each other, so that the second-layer frames, the plurality of electrodes and the plurality of wires are enclosed thereinside; placing a cylinder amid the plurality of manufacturing fixtures for electrode to have the plurality of wires to surround the cylinder; having a fluid plastic to surround the cylinder by filling all the spaces between the plurality of wires and the plurality of electrodes, and waiting the fluid plastic to cure; removing the plurality of first-layer frames and the plurality of second-layer frames; and, pulling off the cylinder.

A multi-prober chuck assembly and channel are provided. The multi-prober chuck assembly, according to one embodiment of the present invention, comprises: a chuck for supporting a wafer; a probe card structure coupled to the top part of the chuck; a heater for heating the chuck under the chuck; a conductive guard plate spaced apart from the heater below the heater; and a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part, wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure.

A probe card having uniform temperature distribution under control to a desired temperature is provided, so as to provide an inspection apparatus and an inspection method. The probe card includes a supporting substrate, a wiring layer arranged including a wiring on a main surface of the supporting substrate, a probe arranged on a surface serving as an opposite side to a side of the supporting substrate of the wiring layer so as to be connected to the wiring, and a plurality of heaters. Further, the probe card is virtually divided into heater regions according to a plurality of heater regions arrayed in vertical and horizontal directions in plan view, and at least one of a plurality of heaters is arranged in each of the plurality of heater regions. An inspection apparatus is configured including the probe card, and an object to be inspected is inspected by use of the inspection apparatus.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

The present disclosure provides a jig for manufacturing probe card for semiconductor inspection, a probe alignment system comprising same, and a probe card manufactured thereby.

A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.