An electric connection device includes a probe (10) and a probe head (20). The probe (10) includes: a tubular barrel (11), a rod-like top-side plunger (121), and a rod-like bottom-side plunger (122). The top- and bottom-side plungers are connected to the barrel (11) with tips thereof exposed from respective open ends of the barrel (11). The probe head (2) includes guide plates (211 and 212) which are spaced apart from each other in the axial direction of the probe (10) and each include a through-hole through which a body of the barrel (11) penetrates. A protrusion (13) having an outer diameter greater than the body of the barrel (11) is provided on the circumference of the probe (10). The guide plates (211 and 212) include a support guide plate in which the through-hole has a diameter smaller than the outer diameter of the protrusion (13). The probe (10) is supported by the support guide plate with the top-side plunger (121) up such that the lower section of the protrusion (13) is in contact with the edge of the upper opening of the through-hole of the support guide plate.

A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

The present disclosure discloses a probe module, comprising: a body, a floating plate located at the bottom of the body and a probe assembly located on the side of the body which is far away from the floating plate. The probe assembly includes a cover plate, a mould core comprising pin grooves and blade pins each limited and fixed in the pin groove by a limiting member. The floating plate comprises pin holes, and the floating plate is configured to be floatable relative to the body in an extension direction of the blade pin and electrical contact terminals of the blade pins may be inserted into the pin holes from the surface of the floating plate close to the body and protrude from the surface of the floating plate which is far away from the body.

A testing device is disclosed including a plurality of elastic members, a plurality of elastic terminals, and a plurality of terminal boards. Each elastic member is provided with an arc-shaped elastic deformation portion, at least one elastic terminal is arranged as one set and is clamped on one elastic member with an inner arc of the elastic deformation portion. Each terminal board is provided with a recess for accommodating one of the elastic members, the recess is provided with at least one arc-shaped groove each matched with a respective elastic terminal, an outer arc of the elastic deformation portion is embedded in a respective arc-shaped groove, each arc-shaped groove has an upper end extending to an upper surface of the terminal board, and a lower end extending to a lower surface of the terminal board.

An electrical connection device includes: a plurality of probes (10) in which distal end portions contact an inspection object (2) during measurement; and a space transformer (30) including a plurality of connection wirings (33), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes (10) is arranged on a first main surface (301), and a second terminal is exposed to a second main surface (302), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (33), proximal end portions of a plurality of same-potential probes (10) set at a same potential during measurement among the plurality of probes (10).

A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.

Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.

A prober includes a plurality of inspection chambers, each of the plurality of inspection chambers including: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a wafer on the chuck top; a seal mechanism configured to form a sealed space between the probe card holder and the chuck top; a temperature adjustor configured to adjust a temperature of the chuck top; and a gas supplier configured to supply a dry gas to the sealed space, and wherein, in a state in which no wafer is placed on the chuck top, the sealed space is purged with the dry gas, and precooling of the probe card is performed by cold heat of the chuck top having a temperature adjusted by the temperature adjustor.

A test apparatus includes a probe card and a tester. The probe card has a plurality of regions corresponding to dies of a wafer, respectively. The probe card includes a tray having a first region with a lens and a second region without a lens. The tester is configured to generate a drive control signal for moving the tray in a first direction or a second direction to locate the first region or the second region at a position facing the dies.