Apparatus for facilitating analytical probing of a packaged electronic device is provided. The device may provide a test chamber that holds the device to be tested and provides an elevated or reduced temperature environment to conduct testing of the device at end-use application temperature levels. The apparatus includes a test chamber having perimeter walls and a configurable cover. The cover includes an adjustable position probe entry port or aperture that may be positioned to provide probe access to any point within the test chamber, and may comprise a cover with such positionable port or a plurality of overlapping plates such as a first plate with a cutout quadrant that can be oriented to expose any quadrant of the test chamber and a second plate with at least one probe entry port that can be situated in the cutout to provide the probe entry port above a desired test area of the electronic device. A height adjustable framework supported above the test chamber allows a probe manipulator to be brought into a required position to operate a probe through the probe entry port of the test chamber and into contact with the packaged electronics. A microscope is positionable above the probe manipulator to assist in placement of the probe. The apparatus is designed so that temperature controlled air may be provided to the test chamber to facilitate testing at elevated or reduced temperatures.

Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.

Embodiments of the present disclosure describe wafer-level die testing devices having a base with a planar X-Y surface, a plurality of thermal actuators situated on the surface, wherein one or more of the plurality of thermal actuators is movable in relation to the base in at least one of the X or the Y directions, and one or more adjustable links, wherein each adjustable link is to adjust a relative position between an individual thermal actuator of the plurality of thermal actuators and one or more other thermal actuators of the plurality of thermal actuators in one or more of the X or the Y directions. Other embodiments may be described and/or claimed.

A method and system are provided for implementing user configurable probing with magnetic connections and printed circuit board (PCB) features. A first magnet is located at a desired probe point on the PCB, a probe having a second magnet of suitable polarity and an electrical contact is moved to the probe point. The first and second magnets attract each other, and the probe point makes electrical contact with an electrical conductor at the probe point.

A system for electrically testing an object, the system may include a scanning electron microscope that comprises a column; and nano-probe modules that are mechanically connected to the column; wherein the column is configured to illuminate areas of the object, with a beam of charged particles; wherein nano-probes of the nano-probe modules are configured to electrically contact elements of the object, during electrical tests of the object, wherein the elements of the object are located within the areas of the object.

A method and system are provided for implementing user configurable probing with magnetic connections and printed circuit board (PCB) features. A first magnet is located at a desired probe point on the PCB, a probe having a second magnet of suitable polarity and an electrical contact is moved to the probe point. The first and second magnets attract each other, and the probe point makes electrical contact with an electrical conductor at the probe point.

The invention relates to a test head for a finger tester for testing printed circuit boards, a finger tester and a method for testing printed circuit boards. The test head comprises a slide, which can be movably arranged on a traverse of the finger tester, a holding module for holding a swivel arm, which is formed at the free end remote from the holding module for receiving a test probe, a lifting device, by means of which the holding module is formed to be movable in the vertical direction relative to the slide, the lifting device comprising a vertical guide rail with a rolling bearing, and a swivel device for rotating the holding module and thus the pivoting arm about a vertical axis of rotation, wherein the swivel device comprises a motor for rotating the swivel device.

The test head is characterized in that the swivel device comprises a shaft or axis, wherein a rotating member of the swivel device is arranged concentrically to the shaft or axis so that the rotating member surrounds the shaft or axis, and the rotating member is either mounted on the axis with at least one bearing or the shaft is mounted on the slide with at least one bearing, and the motor is formed as a direct drive, wherein the rotating member forms the rotor of the motor.

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.