The present disclosure relates to burn-in apparatus, transfer method, burn-in chamber, and interchangeable frame thereof for semiconductor devices burn-in process. The burn-in apparatus comprises of a burn-in chamber with an incomplete base which is adapted to be completed and thermally insulated in cooperation with a thermal insulation base of at least one interchangeable frame which is adapted to be removably moved into and docked in the burn-in chamber to complete the burn-in apparatus. The burn-in apparatus comprises the burn-in chamber and at least one frame. The apparatus is complete and thermally insulated when the frame is moved into the burn-in chamber and docked therein. The apparatus is incomplete and thermally uninsulated when the frame is moved out of the burn-in chamber and undocked therefrom.

A method and apparatus for conducting burn-in testing of semiconductors is provided. A semiconductor device under test (DUT) with a plurality of contact pads is placed into a seal carrier. The seal carrier is then placed within a plurality of first inner walls of an outer housing of a burn-in testing apparatus that is fastened to a cold plate through a printed circuit board (PCB). The seal carrier has a plurality of second inner walls that define a recessed cavity. A lid is placed over the seal carrier and fastened to the outer housing to seal the recessed cavity. The recessed cavity is pneumatically pressurized to force the contact pads of the semiconductor DUT into electrical contact with a plurality of resiliently compressible pins of a socket of the PCB. The socket is then energized to conduct a burn-in test of the semiconductor DUT.

An example test system includes a test socket for testing a DUT, a lid for the test socket, and an actuator configured to force the lid onto the test socket and to remove the lid from the test socket. The actuator includes an upper arm to move the lid, an attachment mechanism connected to the upper arm to contact the lid, where the attachment mechanism is configured to allow the lid to float relative to the test socket to enable alignment between the lid and the test socket, and a lower arm to anchor the actuator to a board containing the test socket. The actuator is configured to move the upper arm linearly towards and away from the test socket and to rotate the upper arm towards and away from the test socket.

A burn-in board includes: a board; sockets mounted on the board; a connector mounted on the board; and wiring systems disposed in the board and connecting the sockets and the connector. The wiring systems comprise: a first wiring system that transmits a first signal; and a second wiring system that transmits a second signal different from the first signal, and a type of a first connection form of the first wiring system is different from a type of a second connection form of the second wiring system.

A semiconductor burn-in oven includes a housing having a chamber, a heating device, testing circuitry having circuit connectors, and a seating assembly. The seating assembly includes a main frame, a main frame actuator connected to the main frame, a plurality of hook members connected to the main frame, and a hook driver. The main frame actuator is configured to drive movement of the main frame along a first axis between an extended position and a retracted position. The hook driver is configured to pivot each of the hook members about a pivot axis between a receiving position and a latching position. Board connectors of burn-in boards supported within the chamber are driven to seat with the circuit connectors when the burn-in boards are latched by the hook members in their latching position and the main frame is moved from the extended position to the retracted position.

A electromagnetic wave test device includes: a reverberation chamber; a first antenna installed inside the chamber and radiating electromagnetic waves of a frequency lower than the chamber's first resonance frequency; a second antenna installed inside the chamber and radiating electromagnetic waves of a frequency equal to or higher than first resonance frequency; a power supply device connected between a grounding member and first antenna and feeding power to the first antenna; a dummy load connected between the grounding member and first antenna; a first power loss inhibiting unit having an impedance corresponding to an allowed value for power loss according to first antenna in a case wherein electromagnetic waves are radiated from the second antenna; and a switching unit including a first switching unit that switches a connection destination of first antenna to one of the dummy load and the first power loss inhibiting unit.

A chamber module and a test handler including the same are disclosed. The chamber module includes a soak chamber providing a temperature adjusting space for adjusting a temperature of semiconductor devices, an elevating member disposed in the soak chamber and for elevating a tray in which the semiconductor devices are accommodated, a guide member extending in a vertical direction in the soak chamber and for guiding movement of the elevating member, and a temperature adjusting part for adjusting a temperature of the guide member.

A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.

The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.

An inspection apparatus configured to inspect a target object includes an inspector configured to perform an inspection of an electrical characteristic upon the target object; a gas flow source provided within the inspector and configured to generate a gas flow which cools an inside of the inspector; a position adjuster configured to place the target object thereon and perform a position adjustment between the placed target object and the inspector; a housing which accommodates the inspector and the position adjuster in a same space; and a circulation device configured to circulate a gas by the gas flow source between the inside of the inspector and a region where the position adjuster is located within the space, the circulation device including a cooler configured to cool the gas being circulated and a foreign substance remover configured to remove a foreign substance from the gas being circulated.