A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.

Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.

The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

A probe test card includes a substrate, a plurality of test needles, and a fixing layer. The substrate includes a trench formed at a surface of the substrate. Each of the test needles includes a first end positioned in the trench and a second end, opposite to the first end, protruding from the trench. The fixing layer is formed in the trench to fix the test needles to the trench. The fixing layer includes a resin layer having a ceramic powder.

A jig (30) includes a first block portion (100) at which a probe head (300) is installed, and a first suction port (112) formed on the first block portion (100). Air present on a side where one end of a probe (330) provided in the probe head (300) is located is sucked from the first suction port (112).

A test board includes a board substrate, a connector at a side of the board substrate, a plurality of device-under-test (DUT) boards which are connected to the board substrate and on which semiconductor devices are mounted as DUTs, and a plurality of DC-DC converters connected to the plurality of DUT boards. The plurality of DC-DC converters convert an input voltage supplied thereto via the connector into operating voltages, and provide the operating voltages to the semiconductor devices on the plurality of DUT boards corresponding thereto. The operating voltages are substantially the same.

An example test socket for a test system includes a receptacle to make electrical and mechanical connections to a device under test (DUT) and a lid to cover the DUT in the receptacle. The lid is controllable to open automatically to enable receipt of the DUT in the receptacle and, following receipt of the DUT, to close automatically to cover the DUT in the receptacle. Closing the lid applies force to the DUT to complete the electrical and mechanical connections between the test socket and the DUT.

A burn-in board management system includes a production burn-in apparatus and a burn-in board status computer. The production burn-in apparatus is configured to test a plurality of integrated circuit devices mounted in slots of a burn-in board and comprising a first controller configured to generate a first burn-in board status map, wherein the first controller is further configured to suspend the burn-in board when the first burn-in board status map of the burn-in board demonstrates that more than a threshold percentage of the slots of the burn-in board are determined to be malfunctioned. The burn-in board status computer is communicably connected with the first controller of the production burn-in apparatus and configured to receive the first burn-in board status map.

An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.