A display panel inspection jig includes a stage comprising a seating area in which a display panel is to be disposed for inspection thereof, and a peripheral area surrounding the seating area, and comprising an uneven upper surface and a lower surface, the seating area of the stage being provided with an opening, a first supporter disposed on a first portion of the uneven upper surface of the stage, and a first barrier disposed on a second portion of the uneven upper surface of the stage. The first portion of the uneven upper surface being at the seating area and spaced apart from the opening, and the second portion of the uneven upper surface is at the peripheral area. The first barrier has an uneven lower surface such that the uneven lower surface of the first barrier and the uneven upper surface of the stage are fitted with each other.

A semiconductor test system has a film frame including a tape portion with one or more openings through the tape portion. The opening is disposed in a center region of the tape portion of the film frame. The film frame may have conductive traces formed on or through the tape portion. A thin semiconductor wafer includes a conductive layer formed over a surface of the semiconductor wafer. The semiconductor wafer is mounted over the opening in the tape portion of the film frame. A wafer probe chuck includes a lower surface and raised surface. The film frame is mounted to the wafer probe chuck with the raised surface extending through the opening in the tape portion to contact the conductive layer of the semiconductor wafer. The semiconductor wafer is probe tested through the opening in the tape portion of the film frame.

Implementations of methods of making a semiconductor device may include: providing a partial semiconductor wafer. The method may also include providing a wafer holder including a tape portion with one or more openings through the tape portion. The method may include mounting the partial semiconductor wafer over the one or more openings in the tape portion of the wafer holder and providing an electrical connection to the partial semiconductor wafer through the one or more openings in the tape portion during probe test.

A contact for burning-in and testing a semiconductor IC and a socket device including the contact are proposed. The contact includes: an upper terminal part (111) having an upper tip part (111b) at an upper end part thereof; a lower terminal part (112) having a lower tip part (112c) at a lower end part thereof and provided on the same axis as the upper terminal part (111); and an elastic part (113) elastically supporting the upper terminal part (111) and the lower terminal part (112), wherein the upper terminal part (111) and the lower terminal part (112) include a shoulder part (111a) and a shoulder part (112a), respectively, formed by protruding therefrom in width directions thereof, and the elastic part (113) has a third width (w3), and includes a first strip (113a) and a second strip (113b).

A testing device for testing an electronic device includes a base, a testing mechanism, a pushing mechanism, and a fastening mechanism. The testing mechanism is rotatably fastened to the base and can be rotated from a first position to a second position. The fastening mechanism is mounted on the base. The pushing mechanism is rotatably mounted on the testing mechanism. When the testing mechanism is rotated from the first position to the second position, the pushing mechanism is rotated and pushes against the testing mechanism. The testing mechanism is connected to an electronic device. The testing mechanism is positioned in the second position via the fastening mechanism.

A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.

An object of the present invention is to provide a prober that is able to carry out accurate inspection of semiconductor device in wafer state by reducing the effect of the external noises and the leakage of current and further by eliminating the stray capacitance of the chuck stage against the prober housing. The present invention attains this object by providing a prober comprising a chuck cover conductor that comprises a bottom conductor and a side conductor and an open top, wherein a chuck stage can be contained within a space surrounded by the bottom conductor and the side conductor; an upper cover conductor which has opening through which the conducting support members of the probe for front-side electrodes and the probe for back-side electrodes can be passed, and which is large enough to cover, in a plane view, at least the open top of the chuck cover conductor when the contact member of the probe for front-side electrodes moves relatively within a wafer under inspection; and, a conducting means that brings the chuck cover conductor and the upper cover conductor into contact and makes them electrically continuous.

A multi-prober chuck assembly and channel are provided. The multi-prober chuck assembly, according to one embodiment of the present invention, comprises: a chuck for supporting a wafer; a probe card structure coupled to the top part of the chuck; a heater for heating the chuck under the chuck; a conductive guard plate spaced apart from the heater below the heater; and a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part, wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure.

A wafer inspection device 10 is provided with a chuck top 20 on which a wafer W having semiconductor devices formed thereon is placed, a probe card 18 having multiple contact probes 28 protruding toward the wafer W, a pogo frame 23 for holding the probe card 18, a cylindrical internal bellows 26 configured to suspend from the pogo frame 23 to surround the contact probes 28, and a cylindrical external bellows 27 configured to suspend from the pogo frame 23 to surround the internal bellows 26. When the chuck top 20 approaches the probe card 18 and the contact probes 28 are brought into contact with the devices, the internal bellows 26 and the external bellows 27 come in contact with the chuck top 20, a sealing space P is formed between the internal bellows 26 and the external bellows 27, and the sealing space P is compressed.