An inspection apparatus includes a load port area in which a carrier accommodation chamber for accommodating a carrier that receives an inspection object is disposed; an inspection area in which a plurality of probe cards are respectively disposed under a plurality of inspection devices, and in which the probe card is pressed against an electronic device of the inspection object on a chuck top to inspect the electronic device; a transfer area in which a transfer mechanism transfers the inspection object onto the chuck top; and a plurality of probe card accommodation devices disposed in at least one of the load port area or the inspection area, each probe card accommodation device being capable of accommodating the probe card, and a number of the probe card accommodation devices being equal to or greater than a number of the probe cards.

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

The present disclosure provides for a kit-less pick and place handler which conducts thermal testing of at least one device. An exemplary handler includes a thermal soak plate, a first prime mover, a second prime mover, a test site actuator, and a test contactor. The thermal soak plate can receive devices and maintain an accurate position of the devices using a friction between the thermal soak plate and the device. The test contactor can electrically contact the device. The first prime mover can place the device on the thermal soak plate. The second prime mover can carry the device to the test contactor, hold the device during thermal testing, and move the device from the test contactor. The test site actuator can exert force on the second prime mover during thermal testing.

A system for testing a semiconductor may include a transfer chamber, at least one loadlock chamber and at least one test chamber. The transfer chamber may include a plurality of sidewalls. The loadlock chamber may be arranged on a first sidewall of the sidewalls of the transfer chamber. The loadlock chamber may include a carrier configured to receive a plurality of wafers. The test chamber may be arranged on a second sidewall of the sidewalls of the transfer chamber. When the transfer chamber is connected to the loadlock chamber, a pressure of the transfer chamber may be changed into a pressure of the loadlock chamber. When the transfer chamber is connected to the test chamber, the pressure of the transfer chamber may be changed into a pressure of the test chamber.

The probe assembly operates with a circuit board test apparatus and includes a main test probe and a secondary test probes. The probe assembly is capable of moving in X, Y and Z directions relative to a circuit board being tested (UUT). The two test probes are movable linearly relative to each other and rotatable together so as to accurately locate the two probes on selected pins on the UUT, for receiving signals from the selected pins. The received signals are transmitted to a display apparatus.

An inspection apparatus for a substrate, comprising: a placing member on which a substrate is placed; a holder configured to hold a probe card having probes; positioning members to be in contact with an upper surface of the placing member to define a height of the placing member with respect to the probes; an adjustment mechanism configured to adjust heights of the positioning members; a detection device; and a control. The controller is configured to execute: positioning the positioning member to a reference height at which an overdrive amount becomes zero, based on the detection results of the probes, the placing member, and the positioning member; and acquiring a height of the positioning member at which a desired overdrive amount is obtained, and raising the placing member while adjusting a driving amount of the adjustment mechanism until the placing member reaches the height.

A testing apparatus for Data Storage Devices (DSDs) includes a chassis and at least one interface module configured to be removably inserted into the chassis and house a plurality of interface boards. Each interface board includes a DSD connector for connecting a DSD to the interface board and a backplane connector for connecting to a backplane for communicating with a respective computing unit. In one aspect, the at least one interface module includes a housing and a plurality of openings in a side of the housing with each opening configured to receive a respective interface board. A plurality of guide member pairs is positioned to guide respective interface boards when inserted into respective openings such that the backplane connector is located at a respective predetermined location for connecting to the backplane. In another aspect, the interface boards are removable from the interface module.

An automated test system for testing singulated electronic components comprises a handler, comprising a plurality of handler pickers and/or spinner pickers, the handler pickers and/or spinner pickers being adapted to each pickup one electronic component, at least one processing station for processing one of the electronic components, a first carrier, a second carrier, and a test unit, for testing singulated electronic components located on a carrier. When the second plurality of electronic components on the second carrier are tested in the test unit while the second plurality of electronic components rest on the second carrier, simultaneously the first carrier is loaded with the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers and/or unloaded from the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers.

A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.