A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier.

The present disclosure relates to burn-in apparatus, transfer method, burn-in chamber, and interchangeable frame thereof for semiconductor devices burn-in process. The burn-in apparatus comprises of a burn-in chamber with an incomplete base which is adapted to be completed and thermally insulated in cooperation with a thermal insulation base of at least one interchangeable frame which is adapted to be removably moved into and docked in the burn-in chamber to complete the burn-in apparatus. The burn-in apparatus comprises the burn-in chamber and at least one frame. The apparatus is complete and thermally insulated when the frame is moved into the burn-in chamber and docked therein. The apparatus is incomplete and thermally uninsulated when the frame is moved out of the burn-in chamber and undocked therefrom.

A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

An example test system includes test sites for testing devices under test (DUTs), where the test sites include a test site configured to hold a DUT for testing. The test system includes a thermal control system to control a temperature of the DUT separately from control over temperatures of other DUTs in other test sites. The thermal control system includes a thermoelectric cooler (TEC) and a structure that is thermally conductive. The TEC is in thermal communication with the DUT to control the temperature of the DUT by transferring heat between the DUT and the structure.

A semiconductor inspection device capable of detecting an abnormality with high sensitivity in a failure analysis of a fine-structured device is provided. An electron optical system radiates an electron beam to a sample on a sample stage. A measurement device measures an output from a measurement probe that is in contact with the sample. An information processing device starts and stops the radiation of the electron beam to the sample, sets a first measurement period in which the measurement device measures the output from the measurement probe during the radiation and a second measurement period in which the measurement device measures the output from the measurement probe after the radiation, and obtains the measurement value of the output from the measurement probe based on a difference between a first measurement value measured in the first measurement period and a second measurement value measured in the second measurement period.

A semiconductor burn-in oven includes a housing having a chamber, a heating device, testing circuitry having circuit connectors, and a seating assembly. The seating assembly includes a main frame, a main frame actuator connected to the main frame, a plurality of hook members connected to the main frame, and a hook driver. The main frame actuator is configured to drive movement of the main frame along a first axis between an extended position and a retracted position. The hook driver is configured to pivot each of the hook members about a pivot axis between a receiving position and a latching position. Board connectors of burn-in boards supported within the chamber are driven to seat with the circuit connectors when the burn-in boards are latched by the hook members in their latching position and the main frame is moved from the extended position to the retracted position.

A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.

This testing system comprises a prober, a tester, a prober control unit for controlling the prober, and a tester control unit for controlling the tester, wherein the tester control unit causes the tester to execute a test which is composed of a plurality of parts on a device to be tested formed on a test body in addition to acquiring an estimated test ending time when the test has reached a predetermined stage, and sends a control signal to the prober control unit so as to transfer the test body into a testing chamber housing the tester before the estimated test ending time.

An inspection apparatus configured to inspect a target object includes an inspector configured to perform an inspection of an electrical characteristic upon the target object; a gas flow source provided within the inspector and configured to generate a gas flow which cools an inside of the inspector; a position adjuster configured to place the target object thereon and perform a position adjustment between the placed target object and the inspector; a housing which accommodates the inspector and the position adjuster in a same space; and a circulation device configured to circulate a gas by the gas flow source between the inside of the inspector and a region where the position adjuster is located within the space, the circulation device including a cooler configured to cool the gas being circulated and a foreign substance remover configured to remove a foreign substance from the gas being circulated.