A method for estimating degradation of a wire-bonded power semi-conductor module is provided. The method includes obtaining an indicator of degradation (Degr.sub.est_t-1); estimating an estimated indicator of degradation (Degr.sub.est_t) by a temporal degradation model; obtaining a set of on-line measure (X.sub.on_meas_t); then, (1) converting the on-line measure (X.sub.on_meas_t) into a deducted indicator of degradation (Degr.sub.meas_t) by an electrical equivalence model, and (2) computing a deviation between estimated and deducted indicator of degradation (Degr.sub.est_t; Degr.sub.meas_t); and/or (1) converting the estimated indicator of degradation (Degr.sub.est_t) into a set of on-line estimation (X.sub.on_est_t), and (2) computing a deviation between set of on-line measure and estimation (X.sub.on_meas_t; X.sub.on_est_t); and correcting the estimated indicator of degradation (Degr.sub.est_t) into a corrected estimated indicator of degradation (Degr.sub.corr_t) as a function of the computed deviation.

The present disclosure provides for a kit-less pick and place handler which conducts thermal testing of at least one device. An exemplary handler includes a thermal soak plate, a first prime mover, a second prime mover, a test site actuator, and a test contactor. The thermal soak plate can receive devices and maintain an accurate position of the devices using a friction between the thermal soak plate and the device. The test contactor can electrically contact the device. The first prime mover can place the device on the thermal soak plate. The second prime mover can carry the device to the test contactor, hold the device during thermal testing, and move the device from the test contactor. The test site actuator can exert force on the second prime mover during thermal testing.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

A temperature control circuit for an electronic device is provided. The temperature control circuit includes a temperature detector, a status detection circuit and a control circuit. The temperature detector is configured to detect a temperature of the electronic device and generate first evaluation information. The status detection circuit is configured to detect a work status of at least one circuit module in the electronic device and generate second evaluation information. The control circuit is configured to adjust at least one electronic parameter of the electronic device according to the first evaluation parameter and the second evaluation parameter to control the temperature of the electronic device.

A memory temperature controlling method and a memory temperature controlling system are provided. The method includes: performing, by a testing equipment, test modes on a memory storage device, and obtaining a first internal temperature of a memory control circuit unit, a second internal temperature of each memory package and a surface temperature of each memory package to establish a linear relationship expression of the first internal temperature, the second internal temperature and the surface temperature; using, by the memory storage device, the linear relationship expression to calculate a predicted surface temperature of a rewritable non-volatile memory based on a first current internal temperature of the memory control circuit unit and a second current internal temperature of each memory package; adjusting, by the memory storage device, an operating frequency for accessing the rewritable non-volatile memory based on the predicted surface temperature.

A computer system that includes a processor device and a storage device is configured to determine a base load at a utility customer site using power usage data for the utility customer site, to determine a variable load at the utility customer site during a range of temperature independent days using the power usage data, and to determine a temperature dependent load at the utility customer site that exceeds the variable load and the base load using the power usage data. The computer system is further configured to assign a flag to each time interval that the temperature dependent load exceeds a power usage threshold and to determine if the utility customer site has an equipment malfunction based on a number of the flags assigned within a time period.

A testing apparatus for Data Storage Devices (DSDs) includes a chassis and at least one interface module configured to be removably inserted into the chassis and house a plurality of interface boards. Each interface board includes a DSD connector for connecting a DSD to the interface board and a backplane connector for connecting to a backplane for communicating with a respective computing unit. In one aspect, the at least one interface module includes a housing and a plurality of openings in a side of the housing with each opening configured to receive a respective interface board. A plurality of guide member pairs is positioned to guide respective interface boards when inserted into respective openings such that the backplane connector is located at a respective predetermined location for connecting to the backplane. In another aspect, the interface boards are removable from the interface module.

A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

An on-die early lifetime failure detection system with a reliability mechanism isolation circuit provides an early lifetime failure detection. The system measures and monitors reliability at time-0 (t0) and end-of-life. The measurements enable detection of latent reliability or marginality issues during the lifetime of the product. The system includes: a stress controller to adjust voltage for a power supply and voltage for a ground supply in accordance with one or more sensors; and an aging detector circuitry coupled to the stress controller, wherein the aging detector circuitry comprises a ring oscillator having delay stages, wherein each delay stage comprises an aging monitor circuitry, wherein the stress controller to adjust voltage for a power supply and voltage for a ground supply of the delay stage.

An inspection system including a first chiller unit configured to supply a first heating medium controlled to a first temperature, a second chiller unit configured to supply a second heating medium controlled to a second temperature lower than the first temperature, a stage having a flow passage supplied with a heating medium mixed with the first heating medium and the second heating medium at a desired mixing ratio, and a controller, wherein the inspection system performs an inspection with respect to a substrate placed on the stage, and the controller controls a process of measuring a temperature of the heating medium at an inlet of the flow passage and a temperature of the heating medium at an outlet of the flow passage, and a process of correcting the mixing ratio of the first heating medium and the second heating medium, based on a difference between the temperatures of the heating medium at the inlet and outlet, and a flow rate of the heating medium, is provided.