A semiconductor device, a semiconductor system, and a control method of a semiconductor device are capable of accurately monitoring the lowest operating voltage of a circuit to be monitored. According to one embodiment, a monitor unit of a semiconductor system includes a voltage monitor that is driven by a second power supply voltage different from a first power supply voltage supplied to an internal circuit that is a circuit to be monitored and monitors the first power supply voltage, and a delay monitor that is driven by the first power supply voltage and monitors the signal propagation period of time of a critical path in the internal circuit.

Adjustable integrated circuits and methods for designing the same are provided. In one embodiment, a method of designing an integrated circuit includes determining a plurality of design criteria of the integrated circuit; designing a plurality of circuit blocks of the integrated circuit in accordance with the plurality of design criteria, where one or more circuit blocks in the plurality of circuit blocks include one or more feedback paths; designing a circuit performance monitor, where the circuit performance monitor includes one or more replica feedback paths corresponding to the one or more feedback paths in the one or more circuit blocks, and where the circuit performance monitor is configured to monitor feedback path information of the one or more replica feedback paths; verifying the plurality of circuit blocks and the circuit performance monitor to meet the plurality of design criteria; and producing a verified description of the integrated circuit for manufacturing.

The present invention relates to a method for calibrating a channel delay skew of automatic test equipment (ATE), the method comprising: providing multiple calibration reference devices, wherein the calibration reference devices have a second plurality of delay paths each having a predetermined path delay value and coupling a pair of pins of one of the calibration reference devices together, wherein each pin is coupled to at most one delay path; coupling each of the calibration reference devices with the ATE, respectively, wherein the test probe of each of the first plurality of test channels is coupled with a pin of one of the calibration reference devices; testing the calibration reference devices to obtain multiple delay measurements from one or more transmitting channels of the first plurality of test channels to one or more receiving channels of the first plurality of test channels using the ATE; and calculating based on the delay measurements.

Techniques for isolating interfaces while testing a semiconductor device include a semiconductor device having a link interface that couples the semiconductor device to a high-speed data transfer link, a clock control unit that transmits one or more clock signals to the link interface; and a protection module. The protection module asserts a clock stop request to the clock control unit and, in response to receiving a clock stop acknowledgement from the clock control unit, asserts a clamp enable to cause the link interface to be isolated from portions of the semiconductor device. After waiting for a first predetermined period of time to expire, the protection module de-asserts the clock stop request.

Systems, methods, and computer readable medium described herein relate to techniques for characterizing and/or anomaly detection in integrated circuits such as, but not limited to, field programmable gate arrays (FPGAs) and application-specific integrated circuits (ASICs). In one example aspect of certain example embodiments, a fully digital technique relies on the pulse width of signals propagated through a path under test. In another example aspect, the re-configurability of the integrated circuit is leveraged to combine the pulse propagation technique with a delay characterization technique to yield better detection of certain type of Trojans and the like. Another example aspect provides for running the test through reconfigurable path segments in order to isolate and identify anomalous circuit elements. Yet another example aspect provides for performing the characterization and anomaly detection without requiring golden references and the like.

The present disclosure generally relates to semiconductor structures and, more particularly, to measurement circuits for logic paths and methods of manufacture. The circuit includes: a flip flop device outputting an output signal comprising an intrinsic delay; a logic path looping the output signal back to the flip flop device such that the intrinsic delay is to be received by the flip flop device; and an oscillator which feeds an input signal into the logic path and sweeps the input signal to alter the looped output signal thereby providing a maximum frequency of the logic path.

A value representative of a dispersion of a propagation delay of assemblies of electronic components is determined. A component test structure includes stages of components and a logic circuit connected in a ring. Each stage includes two assemblies of similar components configured to conduct a signal. A test device is configured to obtain values of the component test structure and to perform operations on these values.

A measurement system may measure a fractional time delay of transmission of a signal across a medium, such as a cable. The system may use a first clock to assist in creating and injecting an injected sequence (signal) into the medium. A second, slower clock may be used for sampling the sequence after transmission of the sequence through the medium. This causes a time Vernier scale effect that results in a sampled sequence that has a one-step skip for each instances of the sequence, where the sequence has N elements in the sequence. The location of the skip within the sequence will depend on the magnitude of the delay measured as a fraction of a clock period with a resolution of N. To measure this delay, a modified version of a pseudo-random sequence generator, capable of skipping one step, is used to determine the output.

A semiconductor device, a semiconductor system, and a control method of a semiconductor device are capable of accurately monitoring the lowest operating voltage of a circuit to be monitored. According to one embodiment, a monitor unit of a semiconductor system includes a voltage monitor that is driven by a second power supply voltage different from a first power supply voltage supplied to an internal circuit that is a circuit to be monitored and monitors the first power supply voltage, and a delay monitor that is driven by the first power supply voltage and monitors the signal propagation period of time of a critical path in the internal circuit.

The present invention relates to a method for calibrating a channel delay skew of automatic test equipment (ATE), the method comprising: providing multiple calibration reference devices, wherein the calibration reference devices have a second plurality of delay paths each having a predetermined path delay value and coupling a pair of pins of one of the calibration reference devices together, wherein each pin is coupled to at most one delay path; coupling each of the calibration reference devices with the ATE, respectively, wherein the test probe of each of the first plurality of test channels is coupled with a pin of one of the calibration reference devices; testing the calibration reference devices to obtain multiple delay measurements from one or more transmitting channels of the first plurality of test channels to one or more receiving channels of the first plurality of test channels using the ATE; and calculating based on the delay measurements.