A method of identifying cell-internal defects: obtaining a circuit design of an integrated circuit, the circuit design including netlists of one or more cells coupled to one another; identifying the netlist corresponding to one of the one or more cells; injecting a defect to one of a plurality of circuit elements and one or more interconnects of the cell; retrieving a first current waveform at a location of the cell where the defect is injected by applying excitations to inputs of the cell; retrieving, without the defect injected, a second current waveform at the location of the cell by applying the same excitations to the inputs of the cell; and selectively annotating, based on the first current waveform and the second current waveform, an input/output table of the cell with the defect.

Process for determining defects in cells of a circuit is provided. A layout of a circuit is received. The layout comprises a first cell and a second cell separated by a boundary circuit. Bridge pairs for the first cell and the second cell is determined. The bridge pairs comprises a first plurality of boundary nodes of the first cell paired with a second plurality of boundary nodes of the second cell. Bridge pair faults between the bridge pairs are modeled. A test pattern for the bridge pair faults is generated.

A performance calculation method suitable for a chip is provided. The chip includes oscillator circuit systems configured to generate oscillation signals and to sense operation states of the chip to adjust periods of the oscillation signals. The method includes following operations: when the chip is in a first operation state, constructing a first function according to the periods of the oscillation signals and a first performance value of the chip; when the chip is in a second operation state, constructing a second function according to the periods of the oscillation signals and a second performance value of the chip; adjusting coefficients of the first or second function according to trajectories of graphs of the first and second functions, so that the graphs of the first and second functions intersect at a coordinate point; constructing a performance function of the chip according to the first and second functions.

Systems and methods are disclosed for testing a device under test (DUT) by receiving a test pattern for a functional test, wherein the test pattern includes a test vector, an expected test result, and an expected power consumption; instructing the test system to run a repetitive loop using a selected functional test as the stimulus; at selected steps in the functional test, measuring power consumption of the DUT; and validating the DUT based on validating the test vector and the power consumption with one or more expected test result patterns and expected power consumption patterns.

A circuit comprises: a bit-flipping signal generation device comprising a storage device and configured to generate a bit-flipping signal based on bit-flipping location information, the storage device configured to store the bit-flipping location information for a first number of bits, the bit-flipping location information obtained through a fault simulation process; a pseudo random test pattern generator configured to generate test patterns based on the bit-flipping signal, the pseudo random test pattern generator comprising a register configured to be a linear finite state machine, the register comprising storage elements and bit-flipping devices, each of the bit-flipping devices coupled to one of the storage elements; and scan chains configured to receive the test patterns, wherein the bit-flipping signal causes one of the bit-flipping devices to invert a bit of the register each time a second number of test patterns is being generated by the pseudo random test pattern generator during a test.

A method performed by a network node operating as a master node (MN) in dual connectivity with a secondary node (SN) for measurement gap configuration, comprises receiving a notification from the secondary node that it will perform a secondary node modification procedure; determining that a measurement gap configuration or reconfiguration is required; and sending a response message to the secondary node in response to said notification, wherein said message includes a gap configuration information.

Constant-output-value gates and buffer gates are determined for gates in a circuit design based on a hold-toggle pattern. The hold-toggle pattern determines in which shift clock cycles in a segment of consecutive shift clock cycles one or more scan chains receive bits based on corresponding bits of a test pattern or same bits as bits of previous shift clock cycles during a shift operation. Activation probabilities and observation probabilities are then determined for circuit nodes of the circuit design based at least in part on the constant-output-value gates and the buffer gates. Finally, test patterns are generated based on the activation probabilities and the observation probabilities.

Systems and methods for multiple device diagnostics are disclosed herein. Exemplary embodiments provide for a multiple device diagnostic system having a plurality of electronic devices selected for diagnosis based on at least one selection criterion, a diagnosis engine in data communication with a failure database, and a diagnosis results database in data communication with the diagnosis engine. Embodiments further provide that the failure database contains grouped failure data from at least one previously diagnosed electronic device, that the wherein the processor diagnoses defects in one or more of the plurality of electronic devices using the grouped failure data, and that the processor outputs the diagnosis results to the diagnosis results database.

A test pattern generating method for generating a test pattern for a circuit under test. The test pattern generating method comprises: (a) computing a plurality of signal delay values which a plurality of cells have due to different defects; (b) comparing the signal delay values and signal path delay information of a target circuit to generate a fault model; and (c) generate at least one test pattern according to the fault model.

A safety analysis method is based on a safety-specific design structural analysis and cone of influence (COI) that does not require fault simulation. The method for performing a safety analysis of an integrated circuit based on a safety-specific design structural analysis and cone of influence comprises generating with a processor a computed set of basic design elements by intersecting two transitive cones of influence, wherein a first cone of influence is a transitive fanin cone of influence starting from a TO element and a second cone of influence is a transitive fanout cone of influence starting from a FROM element.