A 3D semiconductor device including: a first level, where the first level includes a first layer, the first layer including first transistors, and where the first level includes a second layer, the second layer including first interconnections; a second level overlaying the first level, where the second level includes a third layer which includes second transistors, and where the second level includes a fourth layer, the fourth layer including second interconnections; and a plurality of connection paths, where the plurality of connection paths provide first connections from a plurality of the first transistors to a plurality of the second transistors, where the second level is bonded to the first level, where the bonded includes oxide to oxide bond regions, where the bonded includes metal to metal bond regions, where the third layer includes crystalline silicon, and where the second level includes at least one scan-chain to support circuit test.

An electronic device test database generating method, comprising: (a) acquiring cell layout information of a target electronic device; (b) generating possible defect location information of the target electronic device according to the cell layout information, wherein the possible defect location information comprises at least one possible defect location of the target electronic device; (c) testing the target electronic device according to the possible defect location information to generate a testing result; and (d) generating an electronic device test database according to the testing result.

The present disclosure describes a method that includes scanning a circuit layout and identifying layout regions of the circuit layout. The method further includes placing unit cells in a layout region of the layout regions and forming a micro pad structure at a border of a unit cell of the unit cells. The micro pad structure includes interconnect structures that are electrically connected to the unit cell.

An embodiment of an integrated circuit may comprise first circuitry to provide a boundary scan of a signal of the integrated circuit, wherein the first circuit includes an input test data signal and an output test data signal, and second circuitry coupled to the first circuitry to selectively output one of the input test data signal and the output test data signal. Other embodiments are disclosed and claimed.

The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The selecting and accessing of the access ports is achieved using only the dedicated TDI, TMS, TCK, and TDO signal terminals of the device. The selecting and accessing of device access ports can be achieved when a single device is connected to the controller, when multiple devices are placed in a daisy-chain arrangement and connected to the controller, or when multiple devices are placed in a addressable parallel arrangement and connected to the controller. Additional embodiments are also provided and described in the disclosure.

A method includes injecting scan patterns into an input of a decompressor that distributes the scan patterns to a plurality of scan chains whose outputs are coupled to inputs of a compressor, which provides a compressed scan test result representing the plurality of scan chains. The method also includes, in response to the compressed scan test result being indicative of failure, identifying a particular scan chain of the plurality of scan chains that is responsible for the failure by a debug circuit that is coupled to the input of the decompressor and to a compressor output. The debug circuit enables an output of any single scan chain of the plurality of scan chains to be available at the compressor output while suppressing outputs of all other scan chains of the plurality of scan chains.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The selecting and accessing of the access ports is achieved using only the dedicated TDI, TMS, TCK, and TDO signal terminals of the device. The selecting and accessing of device access ports can be achieved when a single device is connected to the controller, when multiple devices are placed in a daisy-chain arrangement and connected to the controller, or when multiple devices are placed in a addressable parallel arrangement and connected to the controller. Additional embodiments are also provided and described in the disclosure.

A testing circuitry includes an on-chip clock controller circuit and a first clock adjustment circuit. The on-chip clock controller circuit is configured to generate an internal clock signal in response to a reference clock signal, a scan enable signal, a plurality of enable bits, and a scan mode signal, and generate a first control signal in response to the scan enable signal, a plurality of first bits, and the reference clock signal. The first clock adjustment circuit is configured to generate a first test clock signal according to the first control signal and the internal clock signal, in order to test a multicycle path circuit. The plurality of first bits are to set a first pulse of the first test clock signal, in order to prevent the multicycle path circuit from occurring a timing violation.

A circuit comprises scan gating devices inserted between outputs of scan chains and inputs of a test response compactor. The scan gating devices divides the scan chains into groups of scan chains. Each of the scan gating devices operates in either an enabled mode or a disenabled mode based on a first signal. A scan gating device operating in the enabled mode blocks, blocks only at some clock cycles, or does not block a portion of a test response of a test pattern captured by and outputted from a scan chain in the associated scan chain group based on a second signal. Scan gating devices operating in the disenabled mode do not block, or based on a third signal, either block or do not block, a portion of the test response captured by and outputted from all scan chains in each of the associated scan chain groups.