A functional element of an embodiment of the technology includes: a first region and a ring-like second region on a top surface of a semiconductor layer having an end surface, the second region surrounding the first region in a space between the first region and the end surface. The functional element of the technology includes a first functional section in the second region, the first functional section allowing for induction of carriers arising on the end surface to outside.

According to an embodiment, a radiation detector comprises a photoelectric conversion substrate and a scintillator layer. The photoelectric conversion substrate converts light into an electrical signal. The scintillator layer contacts the photoelectric conversion substrate and converts radiation incident from the outside into light. The scintillator layer is a fluorescer of CsI containing Tl as an activator. The CsI is a halide. The concentration of the activator inside the fluorescer is 1.6 mass %±0.4 mass %. The concentration of the activator inside the fluorescer in an in-plane direction of the scintillator layer has the relationship of central portion>peripheral portion. The central portion is a central region of a formation region of the scintillator layer. The peripheral portion is an outer circumferential region of the formation region of the scintillator layer.

According to the embodiment, a radiation detector includes an array substrate including a photoelectric conversion element, a scintillator layer formed on the photoelectric conversion element and converting radiation to fluorescence, and a moisture-proof layer including a surface-smoothing layer which is a continuous film formed to cover the scintillator layer and including at least an organic resin material as a main component and a moisture-proof layer which is a continuous film formed on a surface of the smoothed layer by direct film formation and consisting from inorganic material.

A scintillator includes a scintillator layer including a phosphor and an augmenting agent and has an optical reflectance A1 at a wavelength 440 nm and an optical reflectance B1 at a wavelength 520 nm, wherein when an optical reflectance at the wavelength 440 nm is defined as A2 and an optical reflectance at the wavelength 520 nm is defined as B2 after exposure to 2,000R of radiation, ratios between the optical reflectances “A=A2/A1” and “B=B2/B1” before and after exposure to radiation satisfy “0.70≦A/B≦1.10”.

According to the embodiment, a radiation detector includes an array substrate, a scintillator layer, a wall body, and a filled portion, where the array substrate includes a substrate and multiple photoelectric conversion elements, the multiple photoelectric conversion elements are provided on one surface side of the substrate, the scintillator layer includes a first fluorescent material and is provided on the multiple photoelectric conversion elements, the wall body surrounds the scintillator layer and is provided on the one surface side of the substrate, and the filled portion includes a second fluorescent material and is provided between the scintillator layer and the wall body.

The scintillator layer includes a tilted portion in a peripheral edge portion of the scintillator layer; and a thickness of the tilted portion gradually decreases toward the outer side of the scintillator layer.

The filled portion is provided on the tilted portion.

Some embodiments include an electronic device. The electronic device includes a first scintillator layer, a transistor, and one or more device elements over the transistor, and the one or more device elements include a photodetector. Meanwhile, the first scintillator layer is monolithically integrated with at least one of the transistor or the one or more device elements. Other embodiments of related systems, devices, and methods are also disclosed.

A radiographic imaging apparatus includes a sensor substrate including a flexible base material, and an active area which is provided on a first surface of the base material and in which a plurality of pixels, which accumulate electrical charges generated in accordance with light converted from radiation, are formed; a conversion layer that is provided on the first surface side in the sensor substrate to convert radiation into the light; and a grid that is disposed on a second surface side opposite to the first surface of the base material and has a removal portion that has a mesh-like radiation absorbing member provided between a plurality of partitions in units of a predetermined number of pixels to remove scattered radiation according to the radiation.

A radiation imaging apparatus includes a sensor substrate having a plurality of imaging pixels used to capture a radiation image and a detection pixel used to detect radiation; and a housing which accommodates the sensor substrate, wherein the sensor substrate includes an arrangement prohibited region including a stress concentration portion where a stress concentrates due to deformation of the housing, and the detection pixel is arranged in a region different from the arrangement prohibited region.

A method of manufacturing a radiation imaging apparatus includes electrically connecting a first surface of a flexible insulating layer to a conductive portion of a circuit substrate, covering an exposed portion of the conductive portion with a protection layer, and separating the flexible insulating layer from a substrate in contact with a second surface of the flexible insulating layer. The circuit substrate includes an integrated circuit mounted on the circuit substrate. The flexible insulating layer includes, on the first surface, a plurality of pixels arranged in a two-dimensional matrix to convert radiation into an electrical signal. The second surface of the flexible insulating layer is opposite to the first surface of the flexible insulating layer. The flexible insulating layer is separated from the substrate by irradiating the second surface with light transmitting through the substrate.

A radiation detection apparatus can include a scintillator to emit scintillating light in response to absorbing radiation; a photosensor to generate an electronic pulse in response to receiving the scintillating light; an analyzer to determine a characteristic of the radiation; and a housing that contains the scintillator, the photosensor, and the analyzer, wherein the radiation detection apparatus to is configured to allow functionality be changed without removing the analyzer from the housing. The radiation detection apparatus can be more compact and more rugged as compared to radiation detection apparatuses that include a photomultiplier tube.