A radiography apparatus includes a substrate on which a pixel region in which a plurality of pixels that accumulate charges generated in response to incident radiations are arranged is formed on one surface of a flexible base material, a housing which accommodates the substrate and includes a front portion having an incident surface through which the radiations are incident on the substrate, a first buffer layer which is disposed between the front portion and the substrate in a thickness direction of the housing, the first buffer layer having an outer circumference provided inside the pixel region of the substrate in a plan view, and a structure which is disposed between the front portion and the substrate in the thickness direction at a position overlapping with the first buffer layer.

A radiation imaging apparatus includes a sensor substrate having a plurality of imaging pixels used to capture a radiation image and a detection pixel used to detect radiation; and a housing which accommodates the sensor substrate, wherein the sensor substrate includes an arrangement prohibited region including a stress concentration portion where a stress concentrates due to deformation of the housing, and the detection pixel is arranged in a region different from the arrangement prohibited region.

Provided is a radiation detector including a substrate including a sensor unit layer having a plurality of pixels for accumulating electric charges generated depending on light converted from radiation in a pixel region of a flexible base material; a conversion layer that is provided on a surface side of the base material provided with the pixel region to convert the radiation into light; and a fixing member that is provided closer to the substrate side than the conversion layer to fix the sensor unit layer to the base material.

A radiation detection apparatus can include a scintillator to emit scintillating light in response to absorbing radiation; a photosensor to generate an electronic pulse in response to receiving the scintillating light; an analyzer to determine a characteristic of the radiation; and a housing that contains the scintillator, the photosensor, and the analyzer, wherein the radiation detection apparatus to is configured to allow functionality be changed without removing the analyzer from the housing. The radiation detection apparatus can be more compact and more rugged as compared to radiation detection apparatuses that include a photomultiplier tube.

Some embodiments include an electronic device. The electronic device includes a first scintillator layer, a transistor, and one or more device elements over the transistor, and the one or more device elements include a photodetector. Meanwhile, the first scintillator layer is monolithically integrated with at least one of the transistor or the one or more device elements. Other embodiments of related systems, devices, and methods are also disclosed.

A three-dimensional part intended to cooperate with: a single-piece base comprising a first main face, a second main face, the base being delimited by four lateral faces, the base being able to support a digital detector on the first main face and an electronic circuit board, a mechanical protection housing, the base, the digital detector and the electronic circuit board being intended to be arranged in the mechanical protection housing, the housing comprising four lateral faces, a top face and a bottom face; the three-dimensional part being comprising a bottom part linked to the base and at least partially enclosing a lateral face of the base; a top part extending from the first main face of the base to the top face of the housing.

In a sensor substrate, a plurality of pixels are formed in a pixel region of a first surface of a flexible base material, and a terminal portion for electrically connecting a cable is provided in the terminal region of the first surface. A conversion layer is provided outside the terminal region of the base material and converts radiation into light. A reinforcing member is provided on a second surface of the base material to reinforce the strength of the base material. A stress neutral plane adjusting member is provided inside the terminal region and in at least a part, corresponding to the inside of the terminal region, of a cable electrically connected to the terminal portion, adjusts the position of a stress neutral plane in a region corresponding to a laminate in which the reinforcing member, the terminal portion of the sensor substrate, and the cable electrically connected to the terminal portion are laminated, and provides a radiation detector and a radiographic imaging apparatus capable of easily suppressing disconnection of the electrical connection between the cable and the terminal portion.

A radiation detector includes a sensor substrate in which a plurality of pixels for accumulating electric charges generated in response to light converted from radiation is formed in a pixel region of a flexible base material; a conversion layer that is provided on a first surface provided with the pixel region of the base material and converts the radiation into light; an absorption layer that is provided on a side opposite to a side to which the radiation is radiated in a laminate in which the sensor substrate and the conversion layer are laminated and absorbs influence of irregularities generated on the conversion layer on the sensor substrate; and a rigid plate that is provided on a side of the absorption layer opposite to a side facing the laminate and has a higher stiffness than the sensor substrate. Provided are a radiation detector and a radiographic imaging apparatus capable of improving the quality of a radiographic image.

A radiography apparatus includes a substrate on which a pixel region in which a plurality of pixels that accumulate charges generated in response to incident radiations are arranged is formed on one surface of a flexible base material, a housing which accommodates the substrate and includes a front portion having an incident surface through which the radiations are incident on the substrate, a first buffer layer which is disposed between the front portion and the substrate in a thickness direction of the housing, the first buffer layer having an outer circumference provided inside the pixel region of the substrate in a plan view, and a structure which is disposed between the front portion and the substrate in the thickness direction at a position overlapping with the first buffer layer.

The present approaches relate to the fabrication of non-rectangular (e.g., non-square) light imager panels having comparable active areas to rectangular light imager panels but manufactured using fewer c-Si wafers. Such light imager panels may be generally squircle shaped (e.g., a square or rectangle with one or more rounded corners and may be manufactured using conventional crystalline silicon (c-Si) wafers, such as 8″ wafers.