A radiation shielding system for an x-ray digital detector array includes a first radiation shield having a plurality of shielding pads and a plurality of interstices between the plurality of shielding pads, the plurality of shielding pads having a greater thickness than the thickness of the plurality of interstices. The plurality of shielding pads is configured to be positioned over active components of the x-ray digital detector array and the interstices are configured to be positioned over passive components of the x-ray digital detector array.

There are provided a radiation detector module, a radiation detector, and a radiographic imaging apparatus which make it possible to increase the row number while suppressing a length in a body-axis direction. The radiation detector module includes a detector substrate on which a scintillator, a photodiode, and AD conversion chips are loaded, and a control substrate which supplies power to the detector substrate and controls the operation of an AD conversion unit (AFE) of each AD conversion chip of the detector substrate. The plurality of radiation detector modules configure a radiation detector which suppresses the length in the body-axis direction by connecting together the two substrates so as to form a two-stage structure by stacking connectors.

The semiconductor device comprises a substrate of semiconductor material having a main surface, an integrated circuit in the substrate, a photodetector element or array of photodetector elements arranged at or above the main surface, and at least one nanomaterial film arranged above the main surface. At least part of the nanomaterial film has a scintillating property. The method of production includes the use of a solvent to apply the nanomaterial film, in particular by inject printing, by silk-screen printing, by spin coating or by spray coating.

The present disclosure relates to a solid-state image sensor capable of suppressing deterioration of the noise characteristics and the dark characteristics when capturing an image of radiation, a manufacturing method, and a radiation imaging device. A scintillator converts radiation to visible light. Pixels each including a photodiode are formed in a semiconductor substrate. The photodiode photoelectrically converts the visible light that has been converted by the scintillator. Only a silicon oxide film or a negative fixed charge film is formed on the substrate in an element isolation area of the pixel. The present disclosure can be applied to, for example, a radiation imaging device that captures an image of an X-ray with which an object is irradiated.

According to an embodiment, a radiation-scintillated shield which attenuates an incident radiation, includes a shielding part containing an activator-added gadolinium compound as an aggregate. The activator uses the gadolinium compound as a base material and emits light when struck by the radiation. Consequently, it becomes possible to shield a γ-ray and a neutron with a thickness which is about the same as that of a conventional concrete shield of γ-ray shield, and to confirm leakage of radiation.

A signal readout circuit is a circuit for reading out a signal from a photodetection element having a plurality of photodetection pixels each generating a detection signal according to light incidence, and includes N light incidence detection units (N is an integer of 2 or more) each for inputting the detection signal from each of N photodetection pixels and outputting a signal indicating the light incidence, and a total value detection unit for detecting a total value of the output signals from the N light incidence detection units. Each light incidence detection unit outputs the signal weighted differently corresponding to each photodetection pixel. A weight thereof is set such that the total values are different for respective photodetection pixels and all combination patterns of the photodetection pixels.

Method and apparatus for downhole photon imaging. The downhole photon imaging apparatus includes a photon source that emits photons; a scintillation device that generates a light signal in response to received photons; a light sensing device coupled with the scintillation device for generating an electronic signal in response to a received light signal; and a collimator coupled with the scintillation device which has a design that allows photons with single Compton backscattering and backscattered at a pre-determined backscattering angle to be detected by the scintillation device.

A radiation detection device includes a circuit board, a light receiving sensor having a light receiving region and a plurality of circuit regions, an FOP, a scintillator layer, and a plurality of wires. The FOP includes a first portion facing the light receiving region and fixed to the light receiving sensor, a second portion facing the circuit region while separated from the light receiving sensor, and a second portion facing the circuit region while separated from the light receiving sensor. The second portions are integrally formed with the first portion. One end of the wire is connected to the circuit region in a region between the light receiving sensor and the second portion, and one end of the wire is connected to the circuit region in a region between the light receiving sensor and the second portion.

A detection substrate and a flat-panel detector, and relates to the technical field of photoelectric detection. The detection substrate can improve radiation resistance and prolong a service life without increasing the thickness of a scintillator layer. The detection substrate includes a plurality of detection pixel units arranged in an array. Each of the detection pixel units includes: a transistor, a photoelectric conversion section, and a scintillator layer, with the photoelectric conversion section disposed between the transistor and the scintillator layer, the photoelectric conversion section includes a radiation sensitive layer and a photosensitive unit, which are laminated in arrangement; the radiation sensitive layer is configured to absorb rays and convert the rays into carriers; and the photosensitive unit is configured to at least absorb visible light and convert the visible light into carriers. The present disclosure is applicable to the production of the detection substrates.

An image sensor array formed on a flexible first substrate is supported by a flexible second substrate attached thereto. The second substrate has a top surface with an adhesive thereon for attaching the substrates together. The adhesive is on a portion of the second substrate directly beneath the image sensor array to allow selective formation of the second substrate.