An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400° C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical waveguide at least includes: a lower clad layer; a core that is disposed on the lower clad layer and includes an entrance plane and an emission plane; and an optical path converting mirror including an inclined surface that is neither in parallel with nor orthogonal to a plane formed by the lower clad layer. The core includes a restriction release plane. When one of two portions obtained by dividing the core in two at the restriction release plane that is on the side of the entrance plane is defined as a first core pattern portion and remaining one of the two portions on the side of the emission plane is defined as a second core pattern portion, the optical path converting mirror is disposed on an optical path of the first core pattern portion or an extension of the optical path. At least a part of the light that has entered through the entrance plane is reflected by the optical path converting mirror to have an optical path converted. At least a part of light with an optical path not converted to be in a substantially orthogonal direction is emitted from the emission plane.

An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

Example embodiments relate to multilevel coupling for phase front engineering. An example integrated optical structure for phase front engineering of optical beams includes a substrate. The integrated optical structure also includes a plurality of optical layers formed on the substrate. Each of the optical layers includes an optical phased array that includes a plurality of optical waveguides. Each of the optical layers also includes a coupling section for each of the optical waveguides. Each coupling section is configured to control the phase of an optical beam coupling out of the optical waveguide. Additionally, the integrated optical structure includes a slab waveguide formed on the substrate and between two of the optical layers. The slab waveguide is in optical communication with the coupling sections of the two optical layers. The slab waveguide includes a slab waveguide outcoupling structure.

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.

A single mode waveguide with a straight portion and a curved portion, the curved portion having the shape of an adiabatic bend. The single mode waveguide has a curved portion that is shaped according to an adiabatic bend, with a curvature that varies continuously, and that vanishes at a point at which the curved portion is contiguous with a straight portion of the waveguide. The absence of curvature discontinuities avoids the coupling, within the waveguide, of optical power from a fundamental mode into a higher order mode and the curvature of the curved portion results in attenuation of optical power, in higher order modes, that may be coupled into the waveguide at either end.

An arrayed waveguide grating (AWG) device for use in an optical transceiver is disclosed, and can de-multiplex an optical signal into N number of channel wavelengths. The AWG device can include an AWG chip, with the AWG chip providing a planar lightwave (PLC) circuit configured to de-multiplex channel wavelengths and launch the same into output waveguides. A region of the AWG chip may be tapered such that light traveling via the output waveguides encounters an angled surface of the tapered region and reflects towards an output interface region of the AWG chip. Thus detector devices may optically couple to the output interface region of the AWG chip directly, and can avoid losses introduced by other approaches which couple an output of an AWG to detectors by way of a fiber array or other intermediate device.

Disclosed herein is an optical filter configured for wavelength division and multiplexing capable of transmitting and receiving signals. The optical filter includes an optical waveguide configured to receive at an input multiple signals with different wavelengths. The optical filter includes a plurality of channels coupled at different locations along a length of the optical waveguide. Each of the plurality of channels is configured to transmit a respective one of the multiple signals. A number of ring filter stages in a first channel of the plurality of channels that is closer to the input of the optical waveguide is greater than a second channel in the plurality of channels further away from the input of the optical waveguide.

There is provided an optical multiplexing and de-multiplexing element which is provided with a slab waveguide and a waveguide structure and can reduce radiation loss caused in a connection part between the slab waveguide and the waveguide structure. The waveguide structure includes a multimode interference (MMI) waveguide coupler and a narrow-width waveguide, the MMI waveguide coupler and the narrow-width waveguide are connected to each other in this order from a connection position with the slab waveguide along the waveguide direction, step portions are formed on both sides of the MMI waveguide coupler along the waveguide direction, and the thickness of the step portion is smaller than the thickness of the MMI waveguide coupler.

Provided is an optical wavelength multi/demultiplexing circuit with a high rectangular transmission loss spectrum that is able to secure loss flatness of a transmission band, maintain/reduce a guard bandwidth of wavelength channel spacing, and broaden a transmission bandwidth. The circuit uses a multimode waveguide for a connecting part between a field modulation device and an AWG. The field modulation device is constituted by a common input waveguide, an optical branching unit, optical delay lines, a multiplex interference unit, and a mode converter/multiplexer.