Provided is an optical wavelength multi/demultiplexing circuit with a high rectangular transmission loss spectrum that is able to secure loss flatness of a transmission band, maintain/reduce a guard bandwidth of wavelength channel spacing, and broaden a transmission bandwidth. The circuit uses a multimode waveguide for a connecting part between a field modulation device and an AWG. The field modulation device is constituted by a common input waveguide, an optical branching unit, optical delay lines, a multiplex interference unit, and a mode converter/multiplexer.

A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

An athermal arrayed waveguide grating includes a silicon-based substrate and an athermal arrayed waveguide disposed on the silicon-based substrate. The athermal arrayed waveguide includes a cladding layer and a waveguide chip layer, the waveguide chip layer is disposed on the cladding layer and has a refractive index greater than that of the cladding layer; the waveguide core layer includes multilayer structures having a periodic configuration, the multilayer structure includes two layers of silica material and a negative temperature coefficient material disposed between the two layers of silica material; the negative temperature coefficient material is used to compensate for a dimensional deformation of the silicon-based substrate after being heated. The present invention simplifies the structure of the athermal arrayed waveguide grating, sets the negative temperature coefficient material in the waveguide core layer structure, and makes the final temperature coefficient of refractive index of the waveguide structure is a negative number.

An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

Configurations for a tunable Echelle grating are disclosed. The tunable Echelle grating may include an output waveguide centered in a waveguide array, with input waveguides on both sides of the output waveguide. A metal tuning pad may be located over the slab waveguide and may be heated to induce a temperature change in the slab waveguide. By increasing the temperature of the propagation region of the slab waveguide, the index of refraction may shift, thus causing the peak wavelength of the channel to shift. This may result in an optical component capable of multiplexing multiple light sources in an energy efficient manner while maintaining a small form factor.

A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

A photonic integrated circuit includes a photonic device. The photonic device includes an input region configured to receive an input signal including a plurality of multiplexed channels. The photonic device includes a metastructured dispersive region structured to partially demultiplex the input signal into an output signal and a throughput signal. The output signal includes a channel of the multiplexed channels. The throughput signal includes the remaining channels of the multiplexed channels. The photonic device includes an output region and a throughput region optically coupled with the metastructured dispersive region to receive the output signal and the throughput signal, respectively. The metastructured dispersive region includes a heterogeneous distribution of a first material and a second material that structures the metastructured dispersive region to partially demultiplex the input signal into the output signal and the throughput signal.