A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

A semiconductor photonic package can include a laser module and a photonic integrated circuit (PIC), each having a different operating temperature. The two modules are placed on a common substrate allowing accurate optical alignment. In addition, a thermal barrier is integrated into the substrate between the laser module and the PIC to provide thermal stability, especially to the laser module. The substrate can include a housing with good electrical conductivity or an optical substrate and housing. The thermal barrier is integrated into the optical substrate, the housing, or both. The thermal barrier in the optical substrate can be a cutout that does not divide the optical substrate into two separate pieces.

An optical device includes an input array, an output array and a waveguide array. The input array is connected to a first slab structure, while the output array is connected to a second slab structure. The waveguide array is optically coupled to the first slab structure and the second slab structure. The waveguide array includes a first connecting part, a second connecting part and a plurality of waveguide channels. The first connecting part is joined with the first slab structure. The second connecting part is joined with the second slab structure, wherein the second connecting part includes a central portion and at least one flank portion, the central portion is connected to and overlapped with the second slab structure, and the at least one flank portion extends over a side surface of the second slab structure. The waveguide channels are joining the first connecting part to the second connecting part.

An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

A circuit board substrate includes a reinforcing element embedded in a resin material. The reinforcing element includes an optical waveguide. The circuit board substrate can be used in electronic devices as a printed circuit board or the like. A circuit board substrate for use in electronic devices can be formed by embedding a reinforcing element comprising an optical waveguide in a resin. The optical waveguide can be coupled to optical signal transmission and reception elements to transmit an optical signal through the reinforcing element. The optical waveguide may be an optical fiber or the like in some examples.

A checkerboard imager comprises an aperture pair array in a rectangular shape, a 2D optical waveguide grating array, a 3D optical waveguide beam transmission array, a 2D optical waveguide quadrature modulation coupler array, and a photoelectric conversion data acquisition and image processing module. An object light is converged by sub-apertures of the aperture pair array, collected by the 2D optical waveguide grating array, and split into narrow-spectrum beams which are output to the 3D optical waveguide beam transmission array for cross-pairing, modulated and coupled by the 2D optical waveguide quadrature modulation coupler array, and reach the photoelectric conversion data acquisition and image processing module to obtain an object image. A method for implementing the checkerboard imager is provided where each module is independently manufactured and then integrated to improve yield of the modules and imager's optical efficiency, expand equivalent apertures, and improve working capability.

The present disclosure relates to system-level integration of lasers, electronics, integrated photonics-based optical components and a rotation sensing element, which can be a fiber coil or a sensing coil/micro-resonator ring on a sensing chip. Novel waveguide design on the integrated photonics chip, acting as a front-end chip, ensures precise detection of phase change in the fiber coil or the sensing chip, where the sending chip is coupled to the front end chip. Electrical and/or thermal phase modulators are integrated with the integrated photonics chip. Additionally, implant regions are introduced around the waveguides and other optical components to block unwanted/stray light into the waveguides and optical signal leaking out of the waveguide.

The present disclosure provides a multi-channel parallel optical receiving device, including a carrier, a light receiving chip, a plurality of optoelectronic diodes disposed on a top surface of an end of the carrier, an optical fiber connector disposed in another end of the carrier, and an arrayed waveguide grating disposed on the top surface of the carrier. The plurality of optoelectronic diodes is electrically connected to the light receiving chip, and an input end of the arrayed waveguide grating is connected to the optical fiber connector for receiving an optical signal from the optical fiber. The optical signals are divided into multi-channel optical signals in parallel. The top surface of an output end of the arrayed waveguide grating is at a predetermined angle, causing the multi-channel optical signals to be reflected by the top surface and to photosensitive surfaces of the optoelectronic diodes arranged in parallel.

An arrayed waveguide grating (AWG) device for use in an optical transceiver is disclosed, and can de-multiplex an optical signal into N number of channel wavelengths. The AWG device can include an AWG chip, with the AWG chip providing a planar lightwave (PLC) circuit configured to de-multiplex channel wavelengths and launch the same into output waveguides. A region of the AWG chip may be tapered such that light traveling via the output waveguides encounters an angled surface of the tapered region and reflects towards an output interface region of the AWG chip. Thus detector devices may optically couple to the output interface region of the AWG chip directly, and can avoid losses introduced by other approaches which couple an output of an AWG to detectors by way of a fiber array or other intermediate device.

An energy generator including a material having a Curie temperature is provided. The energy generator includes a hot source at a first temperature, a cold sink at a second temperature, a means to couple the hot source to the material while the cold sink is insulated from the material, and a means to couple the cold sink to the material while the hot source is insulated from the material, wherein: the first temperature higher than the Curie temperature, and the second temperature lower than the Curie temperature. Also provided is an energy generator including elements as above, between the hot source and the cold sink. Further provided is a genset having an engine for producing electrical energy, a coolant system, an exhaust element, and an alternator, and an energy generator as above. A method for use an energy generator as above is also provided.