An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

An optical splitting apparatus includes an enclosure, an even optical splitter and an uneven optical splitter that are disposed in the enclosure. A light inlet and a plurality of light outlets are disposed on the enclosure, and fiber adapters are disposed on the light outlets. The light inlet, the even optical splitter, the uneven optical splitter, and the light outlets are connected, so that optical paths are formed between the light inlet and the light outlets by using the even optical splitter and the uneven optical splitter. The light inlet is connected to at least one of a light input end of the even optical splitter and a light input end of the uneven optical splitter, and the fiber adapter on the light outlet is connected to at least one of a light output end of the even optical splitter and a light output end of the uneven optical splitter.

A device includes a scattering structure and a collection structure. The scattering structure is arranged to concurrently scatter incident electromagnetic radiation along a first scattering axis and along a second scattering axis. The first scattering axis and the second scattering axis are non-orthogonal. The collection structure includes a first input port aligned with the first scattering axis and a second input port aligned with the second scattering axis. A method includes scattering electromagnetic radiation along a first scattering axis to create first scattered electromagnetic radiation and along a second scattering axis to create second scattered electromagnetic radiation. The first scattering axis and the second scattering axis are non-orthogonal. The first scattered electromagnetic radiation is detected to yield first detected radiation and the second scattered electromagnetic radiation is detected to yield second detected radiation. The first detected radiation is phase aligned with the second detected radiation.

A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.

An optical telescope may include an array of optical lenslets in a common plane, and optical waveguides extending from respective optical lenslets and each having a common optical path delay. Further, at least one optical star coupler may be downstream from the optical waveguides, and an optical detector may be downstream from the at least one optical star coupler and having an optical image formed thereon.

An optical splitting apparatus includes an enclosure, an even optical splitter and an uneven optical splitter that are disposed in the enclosure. A light inlet and a plurality of light outlets are disposed on the enclosure, and fiber adapters are disposed on the light outlets. The light inlet, the even optical splitter, the uneven optical splitter, and the light outlets are connected, so that optical paths are formed between the light inlet and the light outlets by using the even optical splitter and the uneven optical splitter. The light inlet is connected to at least one of a light input end of the even optical splitter and a light input end of the uneven optical splitter, and the fiber adapter on the light outlet is connected to at least one of a light output end of the even optical splitter and a light output end of the uneven optical splitter.

A device for realizing the splicing of an array fiber and a large-size quartz end cap comprises a carbon dioxide laser, a light splitter, a light beam shaper, a high reflectivity mirror, an image detection module, an array fiber and a carrier thereof, a large-size quartz end cap and a carrier thereof, a stepping motor, a thermodetector, and a computer; a laser beam emitted by the carbon dioxide laser is divided into two light beams through a light splitter, after the two light beams respectively pass through the beam shaper and the high reflectivity mirror, two strip-shaped light spots with uniform power density are integrally formed to heat a splicing face of the large-size quartz end cap, a uniform temperature field of a target splicing area is achieved through indirect heating and heat conduction.

A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.

An optical network architecture can include a first pair of tapered mixing rods and a second pair of tapered mixing rods. A first plurality of plastic optical fibers is communicatively coupled from the first pair of tapered mixing rods to a first plurality of line replaceable components, and a second plurality of plastic optical fibers is communicatively coupled from the second pair of tapered mixing rods to a second plurality of line replaceable components. At least one optical fiber communicatively coupled from the first pair of tapered mixing rods to the second pair of tapered mixing rods, the at least one optical transmission line comprising a hard clad silica optical fiber.

One example optical splitter chip includes a substrate, where the substrate is configured with an input port, configured to receive first signal light, an uneven optical splitting unit, configured to split the first signal light into at least second signal light and third signal light, where optical power of the second signal light is different from optical power of the third signal light, a first output port, configured to output the second signal light, an even optical splitting unit group, including at least one even optical splitting unit, configured to split the third signal light into at least two channels of equal signal light, where optical power of the at least two channels of equal signal light is the same, and at least two second output ports, which are in a one-to-one correspondence with the at least two channels of equal signal light.