Systems and methods are provided for monitoring properties of a microelectromechanical systems (MEMS) oscillating structure. A system includes a MEMS oscillating structure configured as a non-linear resonator to oscillate about a rotation axis; a driver configured to generate a driving force for driving the MEMS oscillating structure about the rotation axis according to an operating response curve during which the MEMS oscillating structure is in resonance, the driver further configured to decrease the driving force when the MEMS oscillating structure is at a predefined tilt angle to induce an oscillation decay of the MEMS oscillating structure; a measurement circuit configured to measure an oscillation frequency and a tilt angle amplitude of the MEMS oscillating structure during a decay period; and processing circuitry configured to determine at least one characteristic of the MEMS oscillating structure based on at least one of the measured oscillation frequency and the measured tilt angle amplitude.

An optical switch for optical fiber large-capacity stored program control exchanges. Optical transmission among optical fibers is performed through the reflection of lasers by a lens part of DMD chips. The lens part of the DMD chips consists of at least two single lenses or at least two lens basic units arranged in an one-dimensional array. The lens basic units are formed by arranging a number of single lenses in an nn matrix, wherein 2n10. The one-dimensional array is arranged in such a direction that lasers do not interfere with each other after reflection. The area of the single lenses or that of the lens basic units is no less than the cross-sectional area of a single optical fiber.

A MEMS element includes a substrate 200, a fixing portion 2 provided at the substrate 200, first and second actuators 3, 4 provided at the fixing portion, a drive target member 7 coupled to the first and second actuators 3, 4, a third actuator 9 provided at the fixing portion 2, and a restriction member 10 coupled to the third actuator. The first and second actuators 3, 4 drive the drive target member 7 in a direction parallel to or crossing an upper surface of the substrate 200. The third actuator 9 drives the restriction member 10 in a direction crossing a movement direction of the drive target member 7 to position the restriction member 10 within a movement plane of the drive target member 7 such that the restriction member 10 restricts displacement of the drive target member 7.

Data center interconnections, which encompass WSCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchal time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting NMD Gbps photonic interconnects wherein N channels are provided each carrying M wavelength division signals at D Gbps.

Data center interconnections, which encompass WCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchal time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting NMD Gbps photonic interconnects wherein N channels are provided each carrying M wavelength division signals at D Gbps.

Data center interconnections, which encompass WSCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchical time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting NMD Gbps photonic interconnects wherein N channels are provided each carrying M wavelength division signals at D Gbps.

A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.

An apparatus includes a polarization rotator or a polarization splitter. The polarization rotator and the polarization splitter each includes a first optical waveguide. The polarization rotator further includes a movable symmetry-breaking micro-electro-mechanical systems (MEMS) dielectric perturber separated from the first optical waveguide by a gap. The first optical waveguide and the MEMS dielectric perturber define a gap therebetween. The polarization rotator also includes a MEMS actuator moving the MEMS dielectric perturber so as to control the gap, thereby controlling polarization rotation within the first optical waveguide. The polarization splitter includes a second optical waveguide separated from the first optical waveguide by a gap. The polarization splitter also includes a MEMS actuator moving the first optical waveguide and/or the second optical waveguide so as to control the gap, thereby controlling polarization splitting between the optical waveguides.

The present invention relates to a MEMS device and related methods comprising a mirror for the measuring of light frequency. The MEMS mirror may rotate around a pivot point and is driven by a periodic force for continuous bi-directional motion without transient vibrations. The periodic force may further comprise transient functions comprising special waveforms when at the turn-around point of the bi-directional rotation.

A deformable mirror and capacitive array controller is capable of controlling a plurality of individual actuators by applying independent voltages from 0V to 240V to each actuator. The device utilizes a distributed microcontroller (MCU) architecture, including a main microcontroller and a plurality of slave microcontrollers to maximize actuator voltage refresh rate. One Slave MCU may be used for up to 384 actuators. For maximizing actuator refresh rate, each Slave MCU may be limited to 192 actuators. The final circuit stage includes a digital/analog converter, a voltage sample and hold and a high voltage amplifier, all packaged in a single integrated circuit. These integrated circuits are referred hereinafter as HV S&H (high voltage sample and hold). A flexible, stacked PCB assembly significantly reduces overall footprint and weight compared to conventional devices. The device's power consumption is nearly an order of magnitude less than that of a conventions adaptive optical system.