A fiber optic device includes a support having one or more optical fibers coupled to the support and a base that includes one or more optoelectronic devices. The support is coupled to the base such that one or more of the optoelectronic devices are optically coupled to one or more of the optical fibers. A portion of the one or more optical fibers that is in contact with the support may be bent and one or more of the optoelectronic devices may be optically coupled to the bent portion of one or more of the optical fibers.

An optical fiber connection system for connecting a plurality optical fibers is described. The connection system comprises a first bare fiber holder comprising a first splice element and a second bare fiber holder comprising a second splice element. Each of the first and second splice elements comprises a splice body having a first end and a second end and a plurality of alternating alignment and clamping channels formed in a top surface of splice body that extend from the first end to the second end of the splice body. When the first and second bare fiber holders are mated, at least a portion of the alignment channels of the first spice element overlap a portion of the clamping channels in the second splice element and at least a portion of the clamping channels of the first splice element overlap a portion of the alignment channels of the second splice element to hold the first and second optical fibers in end to end alignment.

Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.

An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

Apparatus and method are disclosed for co-aligning a number of laterally displaced radiation beams from respective radiation source outputs, each beam having a respective waveband. The apparatus comprises a collimating element for receiving each of said radiation beams with respective lateral displacements and a combining element for receiving each of said radiation beams passed by said collimating element. The apparatus further comprises a radiation source mount for positioning the radiation source outputs relative to the collimating element. The method comprises longitudinally positioning the radiation source outputs upon the mount, relative to the collimating element, in dependence upon the waveband of each beam, to cause the radiation beams passed by the combining element to be co-aligned.

A light coupling element including a groove and a light redirecting member is described. The groove is for receiving and aligning an optical waveguide and incudes an open front end and a back end. The light redirecting member includes an input side for receiving light from an optical waveguide received and supported in the groove and a light redirecting side for changing a direction of light received from the input side. The groove may include a bottom surface extending between the front and back ends of the groove and including a raised bottom surface portion raised upwardly relative to an unraised bottom surface portion. The unraised bottom surface portion of the bottom surface may be disposed between the raised bottom surface portion of the bottom surface and the input side of the light redirecting member. Optical coupling assemblies including the light coupling element and an optical waveguide are described.

The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.

A fiber gripper component includes a fiber receiving recess which extends from a first surface of the fiber gripper component toward a second surface of the fiber gripper component. The fiber receiving recess extends from a front face to a rear face. The fiber receiving recess has a fiber receiving surface which is positioned between the first surface and the second surface. A plurality of resilient fiber receiving grooves extend from the fiber receiving surface toward the second surface. The resilient fiber receiving grooves have a width which is less than an outer-diameter dimension of mating optical fibers to provide a press fit of the optical fibers into the resilient fiber receiving grooves. The fiber gripper component is molded with tolerances in the submicron range to maintain part functionality to allow automatable fiber assembly.

One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.