The present disclosure relates to a method for forming a cavity that traverses a stack of layers including a bottom layer, a first portion of which locally presents an excess thickness, the method comprising a first step of non-selective etching and a second step of selective etching vertically in line with the first portion.

Multi-fiber laser probes utilize relative motion of fibers and other laser probe elements to preserve small-gauge compatibility while providing for multi-spot beam deliver, or to provide for the selectively delivery of single-spot or multi-spot beam patterns. An example probe includes fibers having distal ends that are movable as a group onto a distal ramp element affixed to a distal end of a cannula, so that the distal ends of the fibers can be moved between a retracted position, in which the distal ends of the fibers are within the cannula or ramp element, and an extended position, in which distal ends of the fibers are guided by grooves or channels of the ramp so as to extend at least partially through external openings in the distal end of the laser probe and so as to be pointed angularly away from a longitudinal axis of the cannula.

An optical connection component includes a plurality of optical fibers and a capillary. Each of the optical fibers includes a glass fiber and a resin coating covering the glass fiber. Each of the optical fibers is provided with a coated portion where the glass fiber is covered with the resin coating, and a coating removed portion where the glass fiber is exposed from the resin coating. The coating removed portion is located closer to an end face of the optical fiber than the coated portion. The glass fiber has an outer diameter of less than 124 μm. The capillary has a first end face and a second end face opposing to each other, and a plurality of holes having an opening at the first end face and extending towards the second end face. The holes respectively receive the coating removed portions of the optical fibers.

The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.

The present disclosure relates to methods of assembling a lensed optical fiber array by printing in situ a lens onto each optical fiber of an optical fiber array with an ultrafast laser system where the lens can be shaped to the optical fiber end face to reduce pitch mismatch. In some embodiments, optical fiber(s) of the optical fiber array can be cleaved, and the lens can be shaped to the optical fiber end face to reduce pitch mismatch.

A substrate support includes a plate comprising a top surface and a bottom surface, wherein the top surface is to support a substrate. The plate further comprises an electrode, one or more resistive heating elements, a first plurality of channels, and a plurality of optical fibers in the first plurality of channels, wherein the plurality of optical fibers are removable from the substrate support.

Provided are a micro-hole array capable of accurately holding optical fibers or the like and a method for manufacturing a micro-hole array by which micro-holes having high shape accuracy can be formed. A micro-hole array has thirty or more through holes 3 formed per cm.sup.2 in a glass plate 2 with a thickness of 0.5 mm to 5 mm, both inclusive, the through holes 3 each having a cylindrical portion 5 having a cylindricity of 5% or less of a hole diameter d.sub.1 of the through hole 3.

The disclosure describes a method for assembling an optical coupler, the method may include (a) inserting optical fibers of an array of optical fibers through an array of openings of a mount of the optical coupler so that tips of the optical fibers pass through the array of openings of the mount and reach an adaptor; wherein the array of openings of the mount exhibit a first positioning accuracy; (b) using the adaptor to position the tips of the optical fibers at predefined locations, at a second positioning accuracy that is higher than the first positioning accuracy; (c) fixing the tips of the optical fibers to the mount while maintaining the tips of the optical fibers at the predefined locations; and (d) detaching the mount from the adaptor.

Embodiments described herein include an apparatus for passive alignment of one or more optical fibers with photonic circuitry. Generally, the apparatus includes a substrate that defines a channel configured to receive an engagement portion of a ferrule member. The apparatus further includes deformable and/or non-deformable members within the channel that form alignment faces arranged at opposite ends of the channel. The alignment faces can deform and/or limit the movement of the engagement portion of the ferrule member in order to align the optical fibers along a first dimension. A top surface of the substrate may be configured to engage with one or more lateral surfaces of the ferrule member when the engagement portion is received into the channel, thereby aligning the optical fibers along a second dimension.

A plug connector for connecting optical fibers to an electrical receptacle connector includes a housing defining a cavity therein. At least one printed circuit board (PCB) is disposed in the housing cavity. The PCB includes one or more optoelectronic components disposed on its top surface and electrical contacts disposed proximate a mating edge of the PCB for mating with the receptacle connector. The electrical contacts are electrically connected to the one or more optoelectronic components. One or more optical fibers enter the housing cavity through a housing opening and are optically coupled to the optoelectronic components. A structure comprising a top surface is disposed within the housing cavity between the housing opening and the PCB. The plurality of the optical fibers extends over the top surface of the structure and over at least a portion of the top surface of the PCB. The plurality of the optical fibers is separated from the top surface of the PCB by a first minimum distance and from the top surface of the platform by a second minimum distance less than the first minimum distance.