A method for manufacturing an array of optical fiber ferrules includes producing on a first side of a wafer a pattern of an array of disks or holes (111, 112) in a metallic coating (121, 122). The metallic coating is covered with a negative photoresist layer. A second side of the wafer opposite to the first side is illuminated with light that propagates as a divergent or collimated beam through the photoresist layer, thereby creating a conical pattern within the photoresist layer. The photoresist layer is developed to create conical apertures. A sheet with a conical openings pattern registered to the conical apertures is attached so that a small diameter of each conical opening of the sheet is smaller than, and in contact with, a large diameter of the conical aperture to which it is registered, thereby forming an array of optical fiber ferrules.

A ferrule for an optical connector includes: a ferrule main body that includes fiber holes that extend in a front-rear direction, that are disposed in a left-right direction, and into which optical fibers are inserted, a guide hole into which a guide pin is inserted, and a recessed portion recessed from a rear end surface of the ferrule main body toward a front side on which a connection end surface of the ferrule main body is disposed in the front-rear direction. A vertical direction is perpendicular to both the front-rear direction and the left-right direction. Rear end portions of the fiber holes open at a bottom surface of the recessed portion. The bottom surface includes a first inclined surface inclined toward the fiber holes in a direction toward the front side.

A ferrule mold having a reverse-image of a through-hole array for optical fibers is formed. A non-polymeric ferrule material is deposited in the reverse-image mold, followed by removing the mold to create a multi-fiber connector ferrule having at least two fiber through-holes. An optical fiber is inserted in each through-hole until each fiber endface is positioned approximately even with a connection surface of the ferrule. A fiber recess for each of the optical fibers is formed such that each fiber is recessed from the multi-fiber ferrule connection surface by a distance of at least 0.1 micron. The recess may be formed by differential polishing of the non-polymeric ferrule and endfaces of the optical fibers. Alternatively, a layer of spacer material may be deposited over the multi-fiber ferrule connection surface. An antireflection coating is deposited over the ends of the recessed fibers.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

A ferrule mold having a reverse-image of a through-hole array for optical fibers is formed. A non-polymeric ferrule material is deposited in the reverse-image mold, followed by removing the mold to create a multi-fiber connector ferrule having at least two fiber through-holes. An optical fiber is inserted in each through-hole until each fiber endface is positioned approximately even with a connection surface of the ferrule. A fiber recess for each of the optical fibers is formed such that each fiber is recessed from the multi-fiber ferrule connection surface by a distance of at least 0.1 micron. The recess may be formed by differential polishing of the non-polymeric ferrule and endfaces of the optical fibers. Alternatively, a layer of spacer material may be deposited over the multi-fiber ferrule connection surface. An antireflection coating is deposited over the ferrule connection surface and ends of the recessed fibers.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

An optical connection structure including first optical fibers, second optical fibers, a first optical connector, and a second optical connector is disclosed. The first optical connector is configured such that each of first distal end portions of the first optical fibers protrudes from a first front end surface to the outside when the first optical connector and the second optical connector are connected to each other. Each of the first distal end portions is inserted into a corresponding second fiber hole of the second optical connector. The second optical connector is configured such that each of second distal end portions of the second optical fibers is moved rearward inside second fiber holes due to each of the first distal end portions respectively inserted into the second fiber holes. The first optical fibers and the second optical fibers are optically coupled to each other inside the second fiber holes.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.