A method of forming an optical device includes forming a waveguide mask on a device precursor. The device precursor includes a waveguide positioned on a base. The method also includes forming a facet mask on the device precursor such that at least a portion of the waveguide mask is between the facet mask and the base. The method also includes removing a portion of the base while the facet mask protects a facet of the waveguide. The portion of the base that is removed can be removed such that a recess is defined in the base and/or a shelf is defined on the device precursor. A light source such as an optical fiber or laser can be received in the recess and/or positioned over the shelf such that the light source is optically aligned with the facet of the waveguide.

The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

A method for forming features in transparent dielectric materials is described. The method includes laser micromachining of a transparent dielectric material. The transparent dielectric material is in contact with a liquid containing a fluorinated compound. Features formed by the method have low surface roughness and highly uniform linear dimensions.

An optical fiber structure, includes a substrate, provided with a holding slot; an optical fiber cable, partially arranged in the holding slot; and an isolator, comprising a positioning structure arranged in the holding slot and aligned with an end surface of the optical fiber cable. The present disclosure can not only improve the optical coupling accuracy but also make the optical fiber structure more compact by pasting the isolator in the holding slot and directly aligning with the end surface of the optical fiber cable, which provides a basis for the product to be miniaturized and integrated. The isolator includes a positioning structure, and the isolator has a unidirectional transmission characteristic, therefore, the positioning structure greatly reduces the assembly difficulty and improves the assembly efficiency.

An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising a monolithic block of material, one or more fiber alignment structures formed in the material of the monolithic block, each fiber alignment structure comprising a groove configured to accommodate a corresponding optical fiber, and one or more apparatus alignment features formed in the material of the monolithic block, wherein the one or more apparatus alignment features are additional to the one or more fiber alignment structures and wherein the one or more apparatus alignment features have a known spatial relationship relative to the one or more fiber alignment structures. The one or more apparatus alignment features may enable passive alignment of the apparatus relative to a member which is separate from the apparatus such as an optical component and/or a photonic chip. When one or more optical fibers are located and/or secured in one or more corresponding fiber alignment structures of the apparatus, the one or more apparatus alignment features may also enable passive alignment of the one or more optical fibers relative to the member.

An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising material, and one or more fiber alignment structures defined in the material of the body. Each fiber alignment structure comprises a groove and a corresponding passage. The groove and the corresponding passage are arranged end-to-end. Each fiber alignment structure is configured to accommodate a corresponding optical fiber extending along the groove and the corresponding passage. The groove of each fiber alignment structure may serve or help to guide an end of a corresponding fiber into the corresponding passage during assembly. The groove of each fiber alignment structure may help to support the end of the corresponding optical fiber. The groove of each fiber alignment structure can assist with maintaining a position of the corresponding optical fiber when ribbonised or non-ribbonised optical fiber is used.

An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising material, and one or more fiber alignment structures defined in the material of the body, wherein each fiber alignment structure is configured to accommodate a corresponding optical fiber, and wherein each fiber alignment structure is configured to induce one or more bends along the corresponding optical fiber. When an optical fiber is located in such a fiber alignment structure, the optical fiber may be forced into contact with the fiber alignment structure in one or more known regions so that the corresponding optical fiber is located at a more predictable position relative to the corresponding fiber alignment structure in the one or more known regions than is the case for known fiber alignment structures. The location of the corresponding optical fiber at a more predictable position may improve the optical coupling efficiency achievable between the optical fiber and an optical component and/or a photonic chip.

A method of forming an optical device includes forming a waveguide mask on a device precursor. The device precursor includes a waveguide positioned on a base. The method also includes forming a facet mask on the device precursor such that at least a portion of the waveguide mask is between the facet mask and the base. The method also includes removing a portion of the base while the facet mask protects a facet of the waveguide. The portion of the base that is removed can be removed such that a recess is defined in the base and/or a shelf is defined on the device precursor. A light source such as an optical fiber or laser can be received in the recess and/or positioned over the shelf such that the light source is optically aligned with the facet of the waveguide.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.

A fiber array unit (FAU) and the method for forming the same are provided. The FAU includes a substrate, fiber grooves, and light guiding elements. The substrate has a first region and a second region which are continuous and connected. The fiber grooves are formed in the first region. The light guiding elements are formed in the second region. The fiber grooves are aligned with the light guiding elements, respectively.