A groove alignment structure comprises an etch stop material and a substrate over the etch stop material. A set of grooves is along a first direction in a top surface of the substrate, and adhesive material is in a bottom of the set of grooves. Optical fibers are in the set of grooves over the adhesive material and a portion of the optical fibers extends above the substrate. A set of polymer guides is along the first direction on the top surface of the substrate interleaved with the set of grooves.

A method of forming a micro-lensed fiber optic plate. The method includes obtaining a fiber optic plate that has a plurality of fibers arranged in parallel. A first end of a fiber of the plurality of fibers can have a first numerical aperture. The fiber of the plurality of fibers includes a core material running along a length of the fiber that is circumscribed by a layer of cladding material. The method also includes creating a lensed surface at a second end of the fiber of the plurality of fibers. The second end is opposite the first end. The lensed surface of the fiber of the plurality of fibers can have a second numerical aperture that is different from the first numerical aperture.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

A method of forming a tapered tip of a polarization-maintaining (PM) fiber includes inserting a tip of the PM fiber into a first etchant solution characterized by a first etching rate for the core of the PM fiber and a second etching rate for the stress members of the PM fiber, the second etching rate being lower than the first etching rate, withdrawing the tip of the PM fiber from the first etchant solution at a withdrawal rate, immersing the tip of the PM fiber in a second etchant solution for a time duration. The second etchant solution is characterized by a third etching rate for the core and a fourth etching rate for the stress members, the fourth etching rate being greater than the third etching rate. The method further includes withdrawing the tip of the PM fiber from the second etchant solution.

The disclosed subject matter relates generally to photonic integrated circuit chips, semiconductor assemblies or packagings, and a method of forming the same. More particularly, the present disclosure relates to placement of optical fibers on a photonics chip, and a semiconductor assembly including the photonics chip.

A receptacle for a plurality of light-guiding fibres is provided. The receptacle has a glass part with a first end face, a second end face, a plurality of rectilinear channels extending between the first and second end faces, and a lateral surface between the first and second end faces along a longitudinal direction. The glass part has a length defined between the first and second end faces where the length is greater than a largest transverse dimension of the glass part. The rectilinear channels are open at the first end face and/or the second end face so that the light-guiding fibres are receivable therein, respectively. The rectilinear channels have a channel length that is greater than a channel transverse dimension. The lateral surface has a parting surface thereon.

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

An optical transmitter includes a superconducting driver circuit including at least one Josephson junction, the superconducting driver circuit having a voltage output and having a connection to a circuit ground, a first bias circuit coupled to the voltage output of the superconducting driver circuit, a second bias circuit, wherein the second bias circuit establishes a positive bias voltage relative to the circuit ground, and an electro-optic device having a first end and a second end, wherein the first end of the electro-optic device is coupled to the voltage output of the superconducting driver circuit, and wherein the second end of the electro-optic device is coupled to the second bias circuit.

A method of forming an optical fibre assembly, comprises providing a planar substrate made of a first material; positioning an optical fibre with an outer layer of a first glass material on a surface of the substrate to form a pre-assembly; depositing a further glass material such as silica soot onto the pre-assembly, over at least a part of the optical fibre and adjacent parts of the substrate surface; and heating the pre-assembly to consolidate the further glass material into an amorphous volume in contact with at least parts of the surface of the substrate and the outer layer of the optical fibre, thereby bonding the optical fibre to the substrate to create the optical fibre assembly.