A method of forming an optical fibre assembly, comprises providing a planar substrate made of a first material; positioning an optical fibre with an outer layer of a first glass material on a surface of the substrate to form a pre-assembly; depositing a further glass material such as silica soot onto the pre-assembly, over at least a part of the optical fibre and adjacent parts of the substrate surface; and heating the pre-assembly to consolidate the further glass material into an amorphous volume in contact with at least parts of the surface of the substrate and the outer layer of the optical fibre, thereby bonding the optical fibre to the substrate to create the optical fibre assembly.

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Systems and method for attaching optical elements to a multi-fiber ferrule. The method may include the steps of acquiring a ferrule having a plurality of holes and an output side; providing an optical element having a flat surface such that an orientation of the flat surface of the optical element is facing the output side of the ferrule within a predetermined tolerance; applying an adhesive to the flat surface of the optical element or the output side of the ferrule, the adhesive selected to match the refractive index of the optical element; moving at least one of the optical element and the ferrule with a controlled velocity and acceleration such that the flat surface of the optical element pushes against all of the protruding fibers; and curing the applied adhesive to attach the optical element to the ferrule.

An optical coupler for coupling an optical fiber to a photonic integrated circuit (PIC) is presented. The optical coupler comprises a first curved mirror included in a first substrate layer of the PIC and at a first predefined lateral distance from an optical transceiver associated with the PIC; a second curved mirror included in a second substrate layer and placed at a second predefined lateral distance from the optical fiber; and a spacer located between the first substrate layer and the second substrate layer.

A device comprising a silicon substrate and a waveguide on the silicon substrate. A groove is in the substrate, the groove having a sloped rear wall adjacent to the waveguide. A trench is in the substrate, the trench along a second direction generally orthogonal to the first direction across the sloped rear wall, the trench having a vertical wall at an intersection with the sloped rear wall. An optical fiber in the groove with one end of the optical fiber abutting the vertical wall.

The present disclosure relates to a method for forming a cavity that traverses a stack of layers including a bottom layer, a first portion of which locally presents an excess thickness, the method comprising a first step of non-selective etching and a second step of selective etching vertically in line with the first portion.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC (PIC) is provided by a controlled mating between alignment V-grooves formed in a fiber array support substrate and extra-array alignment ridges formed beyond the extent of a waveguide array integrated within the PIC. The height and width of the alignment ridges are formed to engage with the alignment V-grooves upon mating of the fiber array substrate with the PIC, providing passive alignment while maintaining a physical gap spacing g between the components (ensuring the integrity of the passive alignment).

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

The present invention provides a method for manufacturing a fiber-waveguide coupler comprising depositing a mask layer on a first surface on a front side of a substrate, wherein the mask layer has at least one opening mark; depositing an intermediate layer on the mask layer; bonding a first oxide layer on the intermediate layer; depositing a stress compensation layer on a second surface on a back side of the substrate, wherein at least one of a material and a thickness of the stress compensation layer are selected for reducing a bow of the substrate; depositing a waveguide structure on the first oxide layer, wherein the waveguide structure has a core layer and a cladding layer, wherein the core layer has a predetermined width and a predetermined thickness and is aligned with the opening mark; and anisotropic etching of a V-groove into the substrate at the opening marker of the mask layer such that when a fiber having a predetermined size is placed inside the V-groove, a core of the fiber is centered with respect to the core layer of the waveguide structure. Further, the present invention provides a corresponding fiber-waveguide coupler, a further method for manufacturing a fiber-waveguide coupler as well as a corresponding further fiber-waveguide coupler.