The present disclosure relates to a telecommunication enclosure including a housing and fiber tubes integrated with the housing. The fiber tubes can be integrated with a base of the housing. The fiber tubes can also be integrated with a carrier body of the housing that mounts within an opening of the housing (e.g., an opening in a base of the housing).

A method and system for affixing multi-core fiber (MCF) within a ferrule includes a UV light source and a light guide. MCFs are placed into epoxy filled holders, e.g., channels or v-grooves, of a ferrule. A first MCF in a first holder is clocked to orient its cores to a desired position. The light source is activated, and the light from the light guide is launched into an outer layer of the first MCF, like the cladding layer or a dedicated light carrying layer. The light in the outer layer will stay in the outer layer until it reaches the portion of the first MCF in contact with the epoxy, even if the light is launched from the far end of the fiber remote from the holder. At the holder, the light will leak out due to the similarity in the index of refraction. The leaking light will at least partially cure the epoxy to affix the first MCF within the first holder. The process may then be repeated for the remaining MCFs, so that each MCF may be clocked and affixed selectively rather than collectively.

A method and system for affixing multi-core fiber (MCF) within a ferrule includes a UV light source and a light guide. MCFs are placed into epoxy filled holders, e.g., channels or v-grooves, of a ferrule. A first MCF in a first holder is clocked to orient its cores to a desired position. The light source is activated, and the light from the light guide is launched into a cladding layer of the first MCF. The light in the cladding layer will stay in the cladding layer until it reaches the portion of the first MCF in contact with the epoxy, where the light will leak out due to the similarity in the index of refraction. The leaking light will at least partially cure the epoxy to affix the first MCF within the first holder. The process may then be repeated for the remaining MCFs, so that each MCF may be clocked and affixed selectively rather than collectively.

A hermetic optical subassembly includes an optical bench having a mirror directing optical signals to/from an optical waveguide, a carrier supporting a photonic device, and an intermediate optical bench having a mirror directing optical signals between the photonic device and the optical bench. The optical bench and the intermediate optical bench optically aligns the photonic device to the waveguide along a desired optical path. In one embodiment, the photonic device is an edge emitting laser (EML). The mirror of the optical bench may be passively aligned with the mirror of the intermediate optical bench. The assembled components are hermetically sealed. The body of the optical benches are preferably formed by stamping a malleable metal material to form precise geometries and surface features. In a further aspect, the hermetic optical subassembly integrates a multiplexer/demultiplexer, for directing optical signals between a single optical fiber and a plurality of photonic devices.

Array connector includes a connector body having a mating side. The connector body includes a plurality of substrate layers that are stacked side-by-side and have respective mating edges that form the mating side. The substrate layers form a plurality of interfaces in which each interface is defined between adjacent substrate layers. The adjacent substrate layers of each interface are shaped to form a plurality of channels. The array connector also includes communication lines that are disposed within corresponding channels of the connector body such that the communication lines extend along the interfaces. The communication lines are at least one of wire conductors or optical fibers. The communication lines have respective mating terminals that are positioned proximate to the mating side and form a terminal array.

A fabrication process uses casting to form portions of a waveguide having ultra-flat surfaces. A casting resin is coated between a prism mold and a top flat mold via inkjet, slot die, spray coating, etc. The top flat mold is lowered to conform with the casting resin and the casting resin is then cured to form a bottom prism array. After curing, the bottom prism array is demolded from the prism mold and the top flat mold is used as a carrier wafer to support the bottom prism array. The bottom prism array is selectively coated with a reflective coating and a second casting process is performed by coating the bottom prism array with casting resin to form a reflective waveguide.

An embedded optical fiber termination device includes a fiber holder with an inner bore and an outer surface. The inner bore is configured to receive a length of optical fiber therein. A removable armature is positioned about a portion of the outer surface of the fiber holder and is removably positioned around a portion of the fiber holder. A composite structure and a method of using the embedded device are also provided.

An optical fiber mold device has a first portion that includes a base layer having a longitudinal feature configured to receive an optical fiber. At least one second portion is disposed over the base layer. The second portion has a center wall and front and back end walls. The center wall, the front end wall, and the back end wall form a mold cavity. At least one first hole is disposed in the mold cavity and is configured to allow mold material to enter the mold cavity. At least one second hole in the mold cavity is configured to allow air displaced by the mold material to exit the mold cavity.

An optical fiber mold device has a first portion that includes a base layer having a longitudinal feature configured to receive an optical fiber. At least one second portion is disposed over the base layer. The second portion has a center wall and front and back end walls. The center wall, the front end wall, and the back end wall form a mold cavity. At least one first hole is disposed in the mold cavity and is configured to allow mold material to enter the mold cavity. At least one second hole in the mold cavity is configured to allow air displaced by the mold material to exit the mold cavity.