Disclosed herein are safety devices that are positioned on the end of a fiberoptic cable, such as those used in surgical procedures, to prevent patients and other objects from the risk of burn from light or heat emitted from the end of the cable when not connected to an optical instrument. The disclosed safety devices can be added to the ends of existing cables and/or can be included at the end of cables during manufacture. In some embodiments, the safety device replaces an existing connector at the end of a cable, and in some embodiments the safety device is added in addition to a connector at the end of the cable. In some embodiments, a slit end cover is included over an open end of an adaptor that is mounted on a distal connector of a fiberoptic cable.

A method of processing by controlling one or more beam characteristics of an optical beam may include: launching the optical beam into a first length of fiber having a first refractive-index profile (RIP); coupling the optical beam from the first length of fiber into a second length of fiber having a second RIP and one or more confinement regions; modifying the one or more beam characteristics of the optical beam in the first length of fiber, in the second length of fiber, or in the first and second lengths of fiber; confining the modified one or more beam characteristics of the optical beam within the one or more confinement regions of the second length of fiber; and/or generating an output beam, having the modified one or more beam characteristics of the optical beam, from the second length of fiber. The first RIP may differ from the second RIP.

Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

A photon detection device, configured to couple to a multicore optical fibre, the device comprising a plurality of detection regions, each detection region being arranged to align with just a single core of the multicore optical fibre when the device is coupled to the multicore optical fibre.

Systems for generating solar power are provided. One such system includes a solar radiation collector and one or more side-emitting fiber-optic cables, coupled to the solar radiation collector. The system further includes one or more photovoltaic cell enclosures, including an outer housing and one or more photovoltaic cells, wherein the one or more side-emitting fiber-optic cables is positioned within the outer housing and configured to emit, to the one or more photovoltaic cells, solar radiation collected from the solar radiation collector.

An optical receptacle includes: a first optical surface configured to allow, to enter the optical receptacle, light emitted from the photoelectric conversion element package, or emit, toward the photoelectric conversion element package, light travelled inside the optical receptacle; a second optical surface configured to emit, toward the optical transmission member, the light travelled inside the optical receptacle, or allow, to enter the optical receptacle, light emitted from the optical transmission member; a cylindrical part configured to house at least a part of the photoelectric conversion element package such that the first optical surface and the photoelectric conversion element face each other; and a first groove part disposed at a periphery of the first optical surface.

An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.

Embodiments described herein may be related to apparatuses, processes, and techniques directed to dense integration of PICs in a substrate using an optical fanout structure that includes waveguides formed within a substrate to optically couple with the PICs at an edge of the substrate. One or more PICs may then be electrically with dies such as processor dies or memory dies. The one or more PICs may be located within a cavity in the substrate. The substrate may be made of glass or silicon. Other embodiments may be described and/or claimed.

In some implementations, a fiber optic combiner may comprise an enclosing tube having a geometric shape and multiple optical fibers bundled within the enclosing tube. In some implementations, the multiple fibers comprise at least one optical fiber having a core and a non-circular cladding surrounding the core. The non-circular cladding may cause the multiple optical fibers to have a larger tube fill factor and a lower expected beam parameter product increase factor relative to the multiple optical fibers all having circular claddings.