A method of optimizing the coupling to an optical fiber, including: generating a femtosecond laser pulse; directing a focus of the laser pulse to a longitudinal depth in the region beneath the endface of the optical fiber to generate microvoids; adjusting the intensity of the laser pulse at different depths, such that a refractive index profile is created in the region beneath the endface of the optical fiber.

A coupon wafer comprising a device coupon (110) for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate (124), and the device coupon (110) is attached to the wafer substrate via a tether (122) and the tether (122) is formed from a dielectric material.

A laser source assembly is based upon an optical reference substrate that is utilized as a common optical reference plane upon which both a fiber array and a laser diode array are disposed and positioned to provide alignment between the components. Passive optical components used to provide alignment between the laser diode array and the fiber array are also located on the optical reference substrate. A top surface of the reference substrate is patterned to include alignment fiducials and bond locations for the fiber array receiving block, laser diode array submount and passive optical components. The receiving block is configured to present the optical fibers at a height that facilitates alignment with the output beams from the laser diodes positioned on the silicon submount.

In part, the disclosure relates to an apparatus that may include a first lens; wherein the first lens is enabled to be optically connected to an optical fiber; an isolator core optically coupled to the first lens; a second lens optically coupled to the isolator core; wherein the second lens is enabled to be optically connected to another optical fiber; wherein the isolator core is enabled to allow optical power from the first lens to propagate through the isolator core; wherein the isolator core is enabled to block optical power from the second lens from propagating through the isolator core; a first optical filter optically coupled to the first lens; and a second optical filter optically coupled to the second lens; wherein the second optical filter is enabled to reflect a first frequency; wherein the isolator core is enabled to absorb a remaining portion of the first frequency.

An integrated optical device includes: a mounting base; an optical semiconductor device which is provided on a surface of the mounting base; a substrate; and an optical waveguide which is provided on a surface of the substrate, wherein an incident surface of the optical waveguide is disposed to face an emission surface of the optical semiconductor device, wherein light emitted from the optical semiconductor device is able to be incident to the optical waveguide, wherein the optical semiconductor device is connected to the mounting base through a metal layer, wherein the mounting base is connected to the substrate through the other metal layer, and wherein a mounting base bottom surface on the side opposite to a surface of the mounting base and a substrate bottom surface on the side opposite to a surface of the substrate are provided on the substantially same plane.

Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.

Technologies for coupling to and from a photonic integrated circuit (PIC) with an optical isolator are disclosed. In one embodiment, light beams from waveguides on a PIC die are reflected towards flat mirrors on the bottom surface of the PIC die. The flat mirrors reflect the light towards curved mirrors defined in a top surface of the PIC die, which collimate the beam and direct the collimated beams out the bottom surface of the PIC die. An optical isolator below the PIC die can allow the beams to pass while blocking beams in the opposite direction.

A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

An optical coupling system and method are provided for coupling light from a light source into an optical fiber that reduce back reflection of light into the light source and provide controlled launch conditions that improve forward optical coupling. The optical coupling system comprises at least one flat surface having perturbations formed therein over at least a portion of the flat surface that intersects an optical pathway. The perturbations have a lateral width and a height that are preselected to increase forward optical coupling efficiency and to decrease back reflection of the light beam from the optical fiber end face into the light source. The perturbations improve forward optical coupling by creating a complex light beam shape that is preselected to better match a spatial and angular distribution of a plurality of light modes of the optical fiber.

A fiber connector, comprising a housing comprising a region extending in a lengthwise direction an optical fiber disposed in the region, a first portion of the optical fiber comprising an inner core, a cladding layer surrounding the core, and a first outer polymer layer surrounding the cladding layer and a second portion of the optical fiber comprising the inner core, the cladding layer surrounding the core and a second outer polymer layer that is different from the first polymer layer.