An optical multiplexing circuit includes a plurality of branching units configured to each divide light output from a corresponding one of a plurality of input waveguides, a multiplexing unit configured to multiplex a plurality of first beams of the light, each obtained by dividing the light by a corresponding one of the plurality of branching units, an output waveguide configured to output the light multiplexed by the multiplexing unit, a plurality of monitoring filters configured to individually input, via a first monitoring waveguide, a corresponding one of a plurality of second beams of the light, a wavelength through each of the plurality of monitoring filters having a transmittance of 50% being set to be a center wavelength of the plurality of second beams of the light, and a change in wavelength due to an assumed change in temperature being set to be less than half of an FSR, and a plurality of second monitoring waveguides.

A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

A cell site includes a tower, a multi-service terminal mounted to the tower and a base transceiver station in communication with the multi-service terminal. The multi-service terminal includes a housing and a plurality of adapters mounted to the housing. Each of the adapters includes an outer port accessible from outside the housing and an inner port accessible from inside the housing.

There is provided a beam expander including a first optical element, a second optical element, a composite waveguide including a plurality of waveguide elements, and a dichroic coating provided between the plurality of waveguide elements. The first optical element inputs a collimated incident beam from the outside into the composite waveguide, and the second optical element outputs , from the composite waveguide, collimated incident beam, input to the composite waveguide, wherein the collimated incident beam input into the composite waveguide is divided into multiple wavefronts by the dichroic coating, and the multiple wavefronts are mixed by total internal reflection in the composite waveguide. When the beam expander is used, coherency and collimation of an output beam may be maintained and speckles may be reduced or eliminated while improving the efficiency of an optical system.

An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

A photonic die includes an optical component that can emit output light. The optical component includes a substrate having a length and width that are substantially greater than a thickness thereof, the thickness defining a vertical direction. The optical component includes a vertical edge, and a reflective or antireflective coating on the vertical edge, wherein the reflective or antireflective coating includes a silicon-based material.

An optical interface assembly, comprising a lens, an optical receptacle, a stub disposed in the optical receptacle. The lens includes a convex surface farther away from the stub and a flat surface near the stub, the flat surface and a cross section of the lens being disposed at an inclined angle from each other. A first end surface of the stub facing the lens is disposed at an inclined angle relative to an axis of the stub. When a light beam is coupled into the stub by the lens, a portion of a return light reflected from the first end surface of the stub is reflected to an outside of the lens.

A method of fabricating a device coupon including a waveguide which is suitable for use in a micro-transfer printing process. The method comprises the steps, on a wafer, of: depositing a lower cladding layer on an uppermost surface of the wafer; providing a silicon nitride guiding layer on an uppermost surface of the lower cladding; depositing an upper cladding over at least an uppermost surface of the silicon nitride guiding layer; providing a tether over the coupon, and etching away a region of the uppermost layer of the wafer located between the lower cladding layer and a substrate of the wafer, thereby leaving the lower cladding layer, silicon nitride guiding layer, and upper cladding layer suspended above the wafer via the tether.

An optical probe package structure is provided, used in a test environment for testing a plurality of optical chips on a wafer, including: a main body, an optical fiber, an optical fiber positioning area, a mode field conversion waveguide structure, and an optical waveguide. Wherein, the mode field conversion waveguide structure is used to convert the propagation field of the optical signal, and the optical signal transmitted by the mode field conversion waveguide structure enters the optical waveguide. The optical waveguide has an emitting end, and the emitting end is provided with a facet, the facet has a facet angle, and the facet angle makes the optical signal after field conversion mode field conversion to produce total reflection and output along a second direction. The optical signal after total reflection enters the optical chips. Thereby, an optical probe package structure that can test before wafer cutting and polishing is provided.

An optical multiplexing circuit includes a plurality of branching units configured to each divide light output from a corresponding one of a plurality of input waveguides, a multiplexing unit configured to multiplex a plurality of first beams of the light, each obtained by dividing the light by a corresponding one of the plurality of branching units, an output waveguide configured to output the light multiplexed by the multiplexing unit, a plurality of monitoring filters configured to individually input, via a first monitoring waveguide, a corresponding one of a plurality of second beams of the light, a wavelength through each of the plurality of monitoring filters having a transmittance of 50% being set to be a center wavelength of the plurality of second beams of the light, and a change in wavelength due to an assumed change in temperature being set to be less than half of an FSR, and a plurality of second monitoring waveguides.