An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400° C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

A connector member is configured to be optically connected to an optical cable and to be connected to an output device-side connector that fixes an output device-side end portion of the optical cable. The connector member includes a laser diode (photoelectric conversion portion) configured to receive and emit an optical signal; a flexible light guide tube configured so that one end portion of the light guide tube is optically connected to the laser diode via an optical path conversion member, and so that the other end portion of the light guide tube is optically connected to the optical cable; and a connector that fixes the other end portion of the light guide tube. The connector member is configured to be connected to the output device-side connector. The connector is capable of relative movement with respect to the laser diode.

Disclosed is an optical module including an optical transmitter which is configured to output a first optical signal, an optical receiver which is configured to receive a second optical signal, a holder which is configured to include an optical fiber on which the first optical signal is incident and from which the second optical signal is emitted. The optical module further includes a first optical filter disposed between the optical transmitter and the holder to transmit the first optical signal and reflect the second optical signal, a first parallel light lens disposed between the first optical filter and the optical transmitter, and a second parallel light lens disposed between the first optical filter and the holder.

A connectorized optical chip assembly connectable to an external optical fiber having a fiber connector is provided. The connectorized optical chip assembly includes a substrate, an optical chip having an on-chip optical waveguide and a connectorized interface. The connectorized interface includes an optical coupling element mounted in optical alignment with the on-chip optical waveguide. The connectorized interface includes a chip connector engaging the optical coupling element and configured for mating with the fiber connector of the external optical fiber, so as to provide an optical coupling of light between the optical coupling element and the external optical fiber. The connectorized optical chip assembly also includes a mechanical support structure supporting the connectorized interface onto the substrate. Preferably, the components of the connectorized optical assembly are made of materials heat resistant to temperatures used to melt solder in surface mount processes.

An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

Apparatus for monitoring the output of an optical system. The apparatus comprises first and second fibre optic sections, a reflective coating, and a detector. The first fibre optic section has a first cladding and a first core, and is configured to receive light from the optical system at one end and has at the other end a first angled, polished face. The second fibre optic section has a second cladding and a second core, and has at one end a second angled, polished face. The first and second fibre optic sections are arranged such that the first and second angled, polished faces are substantially parallel and adjacent and the first and second cores are substantially aligned. The reflective coating is applied to the first or second angled, polished face, and is configured to reflect a portion of light transmitted through the first core. The detector is arranged to receive the reflected light.

The present disclosure describes embodiments of a connector and an optical module, pertaining to the technical field of optoelectronic devices. The connector includes a substrate provided with a through-hole passing through the substrate from a first board surface to a second board surface thereof. The second board surface faces opposite from the first board surface. The first board surface is provided with a first groove and a second groove, and the first groove and the second groove respectively are configured to adapt to different optical fiber splices.

An optical assembly may include a platform disposed within a housing that has a limited space. The platform may be tilted by a first angle to fit a fiber array into the limited space of the housing. The optical assembly may also include a silicon photonics device mounted on the tilted platform. The silicon photonics device may include a grating coupler. The optical assembly may also include the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a vertical coupling position by a second angle.

A multi-speed transceiver device includes a chassis having an optical cable connector coupled to a transceiver processor, and an optical waveguide coupling. A data receiving subsystem in the chassis couples the transceiver processor to the optical waveguide coupling, includes data receiving optical waveguides, and transmits first data received from the transceiver processor to the optical waveguide coupling over a number of the data receiving optical waveguides that depends on a first data transmission speed at which the first data was received. A data transmission subsystem in the chassis couples the transceiver processor to the optical waveguide coupling, includes data transmission optical waveguides, and receives second data via the optical waveguide coupling and over a number of the data transmission optical waveguides that depends on a second data transmission speed at which the second data was received, and then transmits that second data to the transceiver processor.

The present disclosure relates to a hybrid opto-electrical module apparatus. The apparatus may have a module substrate having a plurality of electrically conductive circuit traces for carrying electrical signals, and at least one waveguide element for carrying optical signals. A waveguide substrate is in optical communication with the waveguide element. A transducer is supported on the waveguide substrate and in electrical communication with the circuit traces. The waveguide substrate has at least one three dimensional (3D) waveguide formed within its interior volume for routing optical signals between the waveguide element and the transducer. A first optical wirebond interfaces the waveguide element to the 3D waveguide, and a second optical wirebond interfaces the 3D waveguide to the transducer.