A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.

The invention provides an elongated luminescent body (100) comprising an elongated support (170) and a coating layer (180), wherein the elongated luminescent body (100) further comprises a body axis (BA), and a length parameter P of a body dimension perpendicular to the body axis (BA), wherein the length parameter P is selected from height (H), width (W) and diameter (D), wherein: —the elongated support (170) comprises a support material (171), a support material index of refraction n1, wherein the support material index of refraction n1 is at least 1.4, a support surface (172), and a support length (L1); —the coating layer (180) is configured on at least part of the support surface (172) over at least part of the support length (L1), wherein the coating layer (180) comprises a coating layer material (181), a coating layer index of refraction n2, wherein coating layer index of refraction n2 is at least 1.4, and a coating layer thickness (d1), wherein the coating layer material (181) has a composition different from the support material (171), wherein the coating layer material (181) comprises a luminescent material (120) configured to absorb one or more of UV radiation and visible light, and to convert into luminescent material light (8) having one or more wavelengths in one or more of the visible and the infrared; and —the support material (171) is transmissive for the luminescent material light (8), and (i) −0.2≤n1−n2≤0.2 and (ii) d1/P≤0.25 apply.

An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.

A transmission device for guiding a transmission signal is provided, including: a substrate including a signal guide configured to guide the transmission signal; and a refractor arranged on the substrate and corresponding to the signal guide, the refractor provided with a progressive refractive index with which a divergence angle of the transmission signal progressively varies within the refractor.

A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.

An optical module is configured being provided with: a first case fixed to an implementation surface of an implementation substrate to cover an LD and an LD driver; a first filler filled in the first case to seal the LD and the LD driver; a second case fixed to the implementation surface of the implementation substrate to cover the first case in a state of not adhering to the first case; a third case accommodating the implementation substrate and the second case inside; and a second filler filled in the third case to seal the implementation substrate and the second case.

A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.

Apparatus for monitoring the output of an optical system. The apparatus comprises first and second fibre optic sections, a reflective coating, and a detector. The first fibre optic section has a first cladding and a first core, and is configured to receive light from the optical system at one end and has at the other end a first angled, polished face. The second fibre optic section has a second cladding and a second core, and has at one end a second angled, polished face. The first and second fibre optic sections are arranged such that the first and second angled, polished faces are substantially parallel and adjacent and the first and second cores are substantially aligned. The reflective coating is applied to the first or second angled, polished face, and is configured to reflect a portion of light transmitted through the first core. The detector is arranged to receive the reflected light.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include an integrated circuit (IC) in a first layer, wherein the first layer includes a substrate having a first surface, an opposing second surface, and a lateral surface substantially perpendicular to the first and second surfaces, wherein the substrate includes a waveguide between the first and second surfaces, and wherein and the IC is nested in a cavity in the substrate; a PIC in a second layer, wherein the second layer is on the first layer and an active surface of the PIC faces the first layer, and wherein the IC is electrically coupled to the active side of the PIC; and an optical component optically coupled to the active surface of the PIC and the waveguide in the substrate at the second surface.

An optoelectronic module management system includes a network connection communicatively coupled to an optoelectronic module, a memory, and a processing device operatively coupled to the memory. The processing device is configured to perform or control performance of operations that include identify the optoelectronic module via a management network. The optoelectronic module includes a management communication element that is communicatively coupled to the management network and an optical communication element that is communicatively coupled to a fiber optic cable. The operations further include add the optoelectronic module to a list of monitored devices, monitor the optoelectronic module, provide a service to the optoelectronic module in response to the monitoring, and generate a report of the service provided to the optoelectronic module.