An optical device includes a core formed on a substrate, a first source electrode and a second source electrode formed in contact with both side surfaces of the core interposed between the first source electrode and the second source electrode, and a drain electrode formed in contact with an upper surface of the core. The core, the first source electrode, and the second source electrode together form a plasmonic waveguide. The first source electrode and the second source electrode are Schottky coupled to the core.

A multi-layer waveguide display includes a base waveguide layer, one or more grating couplers on one or two surfaces of the base waveguide layer, an overcoat layer on each grating coupler of the one or more grating couplers and filling grating grooves of the grating coupler, and a first waveguide layer stack on a first side of the base waveguide layer. The first waveguide layer stack includes one or more polymer layers. Each of the one or more polymer layers is characterized by a respective refractive index lower than the refractive index of the base waveguide layer. Each polymer layer is formed in a plurality of process cycles, where each process cycle includes dispensing a two-dimensional array of droplets of a resin material to form a thin layer and cross-linking the thin layer to form a sublayer of the polymer layer.

An optical module includes a wiring board having a first electrode, an optical waveguide provided on the wiring board, an optical element having a second electrode and provided on the optical waveguide, a conductive bonding material bonding the first and second electrodes, and a fixing member that fixes the optical element to the optical waveguide. The optical waveguide includes a core layer, a first cladding layer provided on a first side of the core layer, a second cladding layer provided on a second side of the core layer opposite to the first side, and an optical path conversion mirror provided on the core layer or the second cladding layer. The optical element is optically coupled to one end of the core layer via the optical path conversion mirror, and a softening point of the fixing member is higher than a melting point of the conductive bonding material.

Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.

A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

A head-mounted display includes a first image light output unit configured to output first image light, a first light guiding unit configured to guide the first image light output by the first image light output unit, a first optical member configured to reflect the first image light guided by the first light guiding unit to a predetermined first position, and a bridge portion provided to sandwich the first optical member between the first light guiding unit and the bridge portion, wherein at least a part of the bridge portion contains an environmental material.

The invention relates to an optoelectronic device comprising a photonic interposer comprising: a photonic circuit containing at least one active optical component, an upper interconnect layer comprising at least one upper control portion, a lower interconnect layer comprising at least one lower control portion and lower intermediate portions, at least one TSV directly connecting the upper control portion to the lower control portion, conductive vias connecting the lower intermediate portions to the active optical component; at least one first microelectronic chip joined to the upper face of the photonic interposer; a second microelectronic chip joined to the lower face of the photonic interposer, and connected to the lower control portion and to the lower intermediate portions.

A photonic coupler includes an input coupling section, an output coupling section, and a multimode interference (MMI) waveguide section. The input coupling section is adapted to receive an input optical signal along an input waveguide channel. The output coupling section is adapted to output a pair of output optical signals along output waveguide channels. The output optical signals having output optical powers split from the input optical signal. The MMI waveguide section is optically coupled between the input and output coupling sections. Notched waveguide sections may each be disposed between the MMI waveguide section and a corresponding one of the input or output coupling sections and/or the MMI waveguide section may include curvilinear sidewalls.

An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.